公开(公告)号：US6154711A

公开(公告)日：2000-11-28

申请号：US985467

申请日：1997-12-05

申请人： Paul J. Steffan ,  Ming Chun Chen

发明人： Paul J. Steffan ,  Ming Chun Chen

IPC分类号： G03F7/20 ,  H01L21/66

CPC分类号： G03F7/70625 ,  H01L22/20

摘要： A method of manufacturing semiconductor wafers using a simulation tool to determine a set of predicted wafer electrical test parameters. The set of predicted wafer electrical test parameters are compared with wafer electrical test specifications tabulated for each process during the manufacturing process. During the comparison, it is determined whether the predicted wafer electrical test parameters are within the specifications for the process and circuit simulations are then conducted using the predicted wafer electrical test parameters. Device performance is predicted from the circuit simulations and the disposition of the wafer lot is determined utilizing tabulated from a disposition performance table.

摘要翻译： 使用模拟工具制造半导体晶片以确定一组预测的晶片电测试参数的方法。 将预测的晶片电气测试参数的集合与在制造过程期间针对每个处理列出的晶片电气测试规格进行比较。 在比较期间，确定预测的晶片电气测试参数是否在该处理的规格内，然后使用预测的晶片电气测试参数进行电路仿真。 根据电路模拟预测器件性能，并利用从配置性能表格列出来确定晶片批次的布置。

公开(公告)号：US5966459A

公开(公告)日：1999-10-12

申请号：US896341

申请日：1997-07-17

申请人： Ming Chun Chen ,  Paul J. Steffan

发明人： Ming Chun Chen ,  Paul J. Steffan

IPC分类号： G06T7/00 ,  G06K9/00

CPC分类号： G06K9/00 ,  G06T7/0002 ,  G06T7/0004 ,  G06K2209/19 ,  G06T2207/30148

摘要： A method of determining classification codes for defects occurring in semiconductor manufacturing processes and for storing the information used to determine the classification codes. A wafer is selected from a production lot after the lot is sent through a first manufacturing process. The selected wafer is scanned to determine if there are defects on the wafer. Images of selected defects are examined and a numerical value is assigned to each of N elemental descriptor terms describing each defect. A classification code is determined for each defect based upon the numerical values assigned to the N elemental descriptor terms. The classification code and numerical values assigned to the N elemental descriptor terms are stored in a database. The wafer is sent through each sequential process and classification codes are assigned to additional defects selected after each sequential process. The classification codes and numerical values assigned to the N elemental descriptor terms for the additional selected defects are stored in the database. The stored numerical values assigned to the N elemental descriptor terms to modify the classification code. All of the defects stored in the database are assigned new classification codes in accordance with the modified classification code. A new classification code can be generated and all of the stored defects are assigned new classification codes in accordance with the new database.

摘要翻译： 确定半导体制造过程中出现的缺陷的分类代码并存储用于确定分类代码的信息的方法。 在批次通过第一制造过程发送之后，从生产批次中选择晶片。 扫描所选择的晶片以确定晶片上是否存在缺陷。 检查所选缺陷的图像，并且将数值分配给描述每个缺陷的N个元素描述符术语中的每一个。 基于分配给N个元素描述符项的数值，为每个缺陷确定分类代码。 分配给N个元素描述符词的分类代码和数值被存储在数据库中。 通过每个顺序过程发送晶片，并且将分类代码分配给在每个顺序处理之后选择的附加缺陷。 分配给附加选定缺陷的N个元素描述符项的分类代码和数值存储在数据库中。 分配给N个元素描述符术语的存储数值修改分类代码。 存储在数据库中的所有缺陷都按照修改的分类代码分配新的分类代码。 可以生成新的分类代码，并根据新数据库为所有存储的缺陷分配新的分类代码。

公开(公告)号：US6098024A

公开(公告)日：2000-08-01

申请号：US985468

申请日：1997-12-05

申请人： Ming Chun Chen ,  Paul J. Steffan

发明人： Ming Chun Chen ,  Paul J. Steffan

IPC分类号： H01L21/66 ,  G06F19/00

CPC分类号： H01L22/20

摘要： A method of utilizing associated process data parameters in the manufacture of semiconductor wafers by converting tool-based data to lot based data in order to predict wafer electrical test results from measured in-line critical dimensions, lot based data and the converted tool-based data. The converted tool-based data is obtained by interpolating data between a measurement obtained from a tool at a first time and a measurement obtained from the tool at a second time. The data association is obtained using LaPlace-Everett interpolation. The converted tool-based data can also be obtained by extrapolating data from the historical measurements taken from the tool.

摘要翻译： 通过将基于工具的数据转换为批量数据来在半导体晶片的制造中利用相关联的工艺数据参数的方法，以便从测量的在线临界尺寸，基于批次的数据和经转换的基于工具的数据预测晶片电测试结果 。 通过在第一次从工具获得的测量值和从第二时间从工具获得的测量之间内插数据来获得经转换的基于工具的数据。 使用LaPlace-Everett插值获得数据关联。 转换的基于工具的数据也可以通过从从工具获取的历史测量中推断出数据来获得。

公开(公告)号：US5972728A

公开(公告)日：1999-10-26

申请号：US986315

申请日：1997-12-05

申请人： Ming Chun Chen ,  Paul J. Steffan

发明人： Ming Chun Chen ,  Paul J. Steffan

IPC分类号： H01L21/66

CPC分类号： H01L22/20 ,  H01J2237/30433 ,  H01J2237/31701

摘要： A method of obtaining accurate actual ion implantation equipment used in ion implantation processes during the manufacture of semiconductor devices. A monitor structure for each ion implant process is implanted with ions during the ion implant process. A control monitor structure is implanted with boron ions. The concentration profiles of all implanted monitor structure are determined during wafer electrical tests (WET). The as-implanted concentration profile is determined for the boron-implanted control monitor structure and the thermal budget of the manufacturing process is determined. The as-implanted concentration profiles of the remaining monitor structures are determined using the thermal budget determined from the boron-implanted control monitor structure. The actual operating parameters of the ion implantation equipment is determined from the as-implanted concentration profiles.

摘要翻译： 一种在制造半导体器件期间获得用于离子注入工艺的精确实际离子注入设备的方法。 在离子注入过程期间，每个离子注入过程的监测器结构都注入离子。 用硼离子注入控制监视器结构。 在晶圆电测试（WET）期间确定所有植入监测器结构的浓度分布。 确定硼注入控制监视器结构的植入物浓度分布，并确定制造过程的热预算。 使用从硼注入控制监视器结构确定的热预算来确定剩余监视器结构的植入物浓度分布。 离子注入设备的实际操作参数由植入物浓度分布确定。

公开(公告)号：US5905434A

公开(公告)日：1999-05-18

申请号：US987253

申请日：1997-12-08

申请人： Paul J. Steffan ,  Ming Chun Chen

发明人： Paul J. Steffan ,  Ming Chun Chen

IPC分类号： B60Q1/50

CPC分类号： B60Q1/50 ,  B60Q2900/30

摘要： A vehicle communications system having a remote control unit installed in the interior of a vehicle and a display unit located on the exterior of the vehicle. The display unit has an input from the remote control unit and an input from a vehicle interface module that has inputs from the vehicle such as the braking system and the turning signal system. The remote control unit is controllable by the driver in the vehicle and has a table of preset and preprogrammed messages selectable by the driver. The driver selects a message to be displayed and sends the message to the display unit. Any input to the vehicle interface module from the vehicle signaling systems overrides the signal input from the remote control unit unless the display unit is mounted on the front of the vehicle. The driver can select a message from a table of messages that are sequentially displayed on the remote control unit. The table of messages is stored on a flash memory in the remote unit and in a flash memory in the display unit. The table of messages in the remote unit is programmable via a USB programming port. The table of messages in the display unit can be programmed via an RF signal sent to the display unit by the remote unit.

摘要翻译： 一种具有安装在车辆内部的遥控单元和位于车辆外部的显示单元的车辆通信系统。 显示单元具有来自遥控单元的输入和来自车辆接口模块的输入，其具有来自诸如制动系统和转向信号系统的车辆的输入。 遥控单元可由车内驾驶员控制，并具有可由驾驶员选择的预置和预编程信息表。 驱动程序选择要显示的消息，并将消息发送到显示单元。 来自车辆信号系统的车辆接口模块的任何输入都将覆盖从遥控单元输入的信号，除非显示单元安装在车辆前方。 驱动程序可以从依次显示在遥控器上的消息表中选择一条消息。 消息表存储在远程单元中的闪存和显示单元中的闪存中。 远程单元中的消息表可以通过USB编程端口进行编程。 显示单元中的消息表可以通过远程单元发送到显示单元的RF信号进行编程。

公开(公告)号：US6041270A

公开(公告)日：2000-03-21

申请号：US985470

申请日：1997-12-05

申请人： Paul J. Steffan ,  Ming Chun Chen

发明人： Paul J. Steffan ,  Ming Chun Chen

IPC分类号： G03F7/20 ,  H01L21/66 ,  G06F19/00

CPC分类号： G03F7/70625 ,  H01L22/20

摘要： A method of manufacturing semiconductor wafers using a simulation tool to determine a set of predicted wafer electrical test measurements that are compared to a set of target wafer electrical test measurements to obtain a set of optimized process parameters for the equipment for the next process. The optimized process parameters are compared to the equipment characteristics for the equipment of the next process and the process parameters for the next process are automatically adjusted.

摘要翻译： 使用模拟工具制造半导体晶片的方法来确定与一组目标晶片电测试测量值相比较的一组预测的晶片电测试测量，以获得用于下一工艺的设备的一组优化的工艺参数。 将优化的工艺参数与下一工艺设备的设备特性进行比较，并自动调整下一工序的工艺参数。

公开(公告)号：US5999003A

公开(公告)日：1999-12-07

申请号：US989831

申请日：1997-12-12

申请人： Paul J. Steffan ,  Ming Chun Chen

发明人： Paul J. Steffan ,  Ming Chun Chen

IPC分类号： G01R31/28 ,  H01L21/66 ,  G01R21/26 ,  G06K9/00

CPC分类号： H01L22/20 ,  G01R31/2831 ,  G01R31/2837

摘要： A method to accurately classify defects on a semiconductor wafer wherein a scanning tool detects defects and assigns values to parameters that are characteristic of each defect. The values of the characteristic parameters represent a thumbprint of each defect and the defects are placed into "bins" according to the thumbprint of each defect. A sample of defects in each bin is analyzed and assigned a classification code.

摘要翻译： 准确地分类半导体晶片上的缺陷的方法，其中扫描工具检测缺陷并且将值分配给每个缺陷特征的参数。 特征参数的值表示每个缺陷的指纹，并且根据每个缺陷的指纹将缺陷放置到“仓”中。 分析每个仓库中的缺陷样本并分配一个分类代码。

公开(公告)号：US5946213A

公开(公告)日：1999-08-31

申请号：US955774

申请日：1997-10-22

申请人： Paul J. Steffan ,  Ming Chun Chen

发明人： Paul J. Steffan ,  Ming Chun Chen

IPC分类号： H01L21/66 ,  G06F19/00

CPC分类号： H01L22/20

摘要： A defect management system with a method to identify and reclassify previously classified propagator defects. The defect management system also has a method of identifying cluster defects and selecting at least one cluster defect to classify.

摘要翻译： 一种缺陷管理系统，其具有识别和重新分类先前分类的传播缺陷的方法。 缺陷管理系统还具有识别集群缺陷并选择至少一个集群缺陷进行分类的方法。

公开(公告)号：US5862055A

公开(公告)日：1999-01-19

申请号：US896340

申请日：1997-07-18

申请人： Ming Chun Chen ,  Paul J. Steffan ,  Steven J. Zika

发明人： Ming Chun Chen ,  Paul J. Steffan ,  Steven J. Zika

IPC分类号： G06T7/00 ,  G06F19/00

CPC分类号： G06K9/00 ,  G06T7/0004 ,  G06K2209/19 ,  G06T2207/30148

摘要： A method of determining classification codes for defects occurring in semiconductor manufacturing processes and for storing the information used to determine the classification codes. A wafer is selected from a production lot after the lot is sent through a first manufacturing process. The selected wafer is scanned to determine if there are defects on the wafer. Images of selected defects are examined and a numerical value is assigned to each of N elemental descriptor terms describing each defect. A classification code is determined for each defect based upon the numerical values assigned to the N elemental descriptor terms. The classification code and numerical values assigned to the N elemental descriptor terms are stored in a database. The wafer is sent through each sequential process and classification codes are assigned to additional defects selected after each sequential process. The classification codes and numerical values assigned to the N elemental descriptor terms for the additional selected defects are stored in the database.

摘要翻译： 确定半导体制造过程中出现的缺陷的分类代码并存储用于确定分类代码的信息的方法。 在批次通过第一制造过程发送之后，从生产批次中选择晶片。 扫描所选择的晶片以确定晶片上是否存在缺陷。 检查所选缺陷的图像，并且将数值分配给描述每个缺陷的N个元素描述符术语中的每一个。 基于分配给N个元素描述符项的数值，为每个缺陷确定分类代码。 分配给N个元素描述符词的分类代码和数值被存储在数据库中。 通过每个顺序过程发送晶片，并且将分类代码分配给在每个顺序处理之后选择的附加缺陷。 分配给附加选定缺陷的N个元素描述符项的分类代码和数值存储在数据库中。

公开(公告)号：US06174738B1

公开(公告)日：2001-01-16

申请号：US08979630

申请日：1997-11-28

申请人： Paul J. Steffan ,  Ming Chun Chen

发明人： Paul J. Steffan ,  Ming Chun Chen

IPC分类号： G01R3126

CPC分类号： H01L22/20

摘要： A method of determining an accurate disposition decision for each inspected layer in a wafer lot wherein a measured defect density is compared to a calculated disposition criterion determined for each inspected layer. If the measured defect density is above the calculated disposition criterion the wafer lot is placed on hold and if the measured defect density is at or below the calculated disposition criterion the wafer lot is sent to the next process. The disposition criterion for each layer is determined from a yield value determined for each layer. The yield value is the yield necessary for each layer to obtain a profitable product and is determined from cost data for each die in the wafer lot and a risk factor determined by management and includes market data such as selling price and demand for the product. The yield value is combined with defect sensitivity determined for each layer. The defect sensitivity is determined from the combination of critical area and historical frequency for each layer.

摘要翻译： 确定晶片批中每个被检测层的精确配置决定的方法，其中测量的缺陷密度与为每个被检测层确定的计算出的配置标准进行比较。 如果测量的缺陷密度高于计算的处置标准，则晶片批次被置于保持状态，并且如果测量的缺陷密度等于或低于计算出的配置标准，则将晶片批次发送到下一个处理。 每个层的配置标准是从为每个层确定的屈服值确定的。 收益率值是每个层获得有利产品所需的收益，并根据晶片批次中的每个模具的成本数据和由管理确定的风险因素确定，并包括市场数据，如销售价格和产品需求。 屈服值与每层确定的缺陷敏感度相结合。 缺陷敏感度由各层的临界面积和历史频率的组合确定。