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1.发明授权公开(公告)号：US07358958B2
公开(公告)日：2008-04-15
申请号：US10840068
申请日：2004-05-05
IPC分类号： G09G5/08
CPC分类号： G06F3/0317
摘要： An optical tracking assembly for an optical mouse includes a light source, an optical sensor chip, and an integral optics assembly. The integral optics assembly includes lenses and alignment features receiving the light source. The alignment features center the light source to the lenses and control a distance the light source is placed away from a navigation surface that reflects light onto the optical sensor chip. The lenses may include (1) collimating lenses for collimating light from the light source along a first optical axis to the navigation surface, and (2) imaging lenses for imaging reflected light from the navigation surface along a second optical axis to the optical sensor chip.
摘要翻译： 用于光学鼠标的光学跟踪组件包括光源，光学传感器芯片和整体光学组件。 整体光学组件包括接收光源的透镜和对准特征。 对准特征将光源中心到透镜，并且控制光源放置的距离远离将光反射到光学传感器芯片上的导航表面的距离。 透镜可以包括：（1）准直透镜，用于将来自光源的光沿着第一光轴准直到导航表面，以及（2）成像透镜，用于将来自导航表面的反射光沿第二光轴成像到光学传感器芯片 。
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2.发明申请公开(公告)号：US20050249449A1
公开(公告)日：2005-11-10
申请号：US10840068
申请日：2004-05-05
申请人： Paul Welch , Sai-Mun Lee , Gurbir Singh A/L Singh , Ak-Wing Leong
发明人： Paul Welch , Sai-Mun Lee , Gurbir Singh A/L Singh , Ak-Wing Leong
CPC分类号： G06F3/0317
摘要： An optical tracking assembly for an optical mouse includes a light source, an optical sensor chip, and an integral optics assembly. The integral optics assembly includes lenses and alignment features receiving the light source. The alignment features center the light source to the lenses and control a distance the light source is placed away from a navigation surface that reflects light onto the optical sensor chip. The lenses may include (1) collimating lenses for collimating light from the light source along a first optical axis to the navigation surface, and (2) imaging lenses for imaging reflected light from the navigation surface along a second optical axis to the optical sensor chip.
摘要翻译： 用于光学鼠标的光学跟踪组件包括光源，光学传感器芯片和整体光学组件。 整体光学组件包括接收光源的透镜和对准特征。 对准特征将光源中心到透镜，并且控制光源放置的距离远离将光反射到光学传感器芯片上的导航表面的距离。 透镜可以包括：（1）准直透镜，用于将来自光源的光沿着第一光轴准直到导航表面，以及（2）成像透镜，用于将来自导航表面的反射光沿第二光轴成像到光学传感器芯片 。
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公开(公告)号：US07473889B2
公开(公告)日：2009-01-06
申请号：US11015900
申请日：2004-12-16
申请人： Poh-Huat Lye , Ak-Wing Leong
发明人： Poh-Huat Lye , Ak-Wing Leong
CPC分类号： H01L31/0203 , H01L27/14618 , H01L2924/0002 , H01L2924/00
摘要： An optical device and method for making the same is disclosed. The device includes having a circuit element that is located in an opaque enclosure. The circuit element includes a die having an optical integrated circuit mounted on a carrier. The carrier includes a plurality of conductors connected to the optical integrated circuit. The opaque enclosure has a transparent window therein. The carrier is positioned in the enclosure such that light entering the enclosure through the window illuminates the die. The enclosure further includes an aperture through which the conductors protrude from the enclosure. The enclosure is at least partially filled with a layer of optically transparent material that passes light utilized or generated by said optical integrated circuit. The enclosure can be preformed to a higher degree of precision than that obtainable on conventional packaging fabrication lines.
摘要翻译： 公开了一种用于制造它的光学装置及其制造方法。 该设备包括具有位于不透明外壳中的电路元件。 电路元件包括具有安装在载体上的光学集成电路的管芯。 载体包括连接到光学集成电路的多个导体。 不透明的外壳在其中具有透明窗口。 载体位于外壳中，使得通过窗口进入外壳的光照亮模具。 外壳还包括孔，导体通过该孔从外壳突出。 外壳至少部分地填充有透光材料层，该层透过由所述光学集成电路使用或产生的光。 外壳可以比在常规包装生产线上获得的精度更高的精度进行。
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公开(公告)号：US20060131477A1
公开(公告)日：2006-06-22
申请号：US11015900
申请日：2004-12-16
申请人： Poh-Huat Lye , Ak-Wing Leong
发明人： Poh-Huat Lye , Ak-Wing Leong
IPC分类号： H01L27/00
CPC分类号： H01L31/0203 , H01L27/14618 , H01L2924/0002 , H01L2924/00
摘要： An optical device and method for making the same is disclosed. The device includes having a circuit element that is located in an opaque enclosure. The circuit element includes a die having an optical integrated circuit mounted on a carrier. The carrier includes a plurality of conductors connected to the optical integrated circuit. The opaque enclosure has a transparent window therein. The carrier is positioned in the enclosure such that light entering the enclosure through the window illuminates the die. The enclosure further includes an aperture through which the conductors protrude from the enclosure. The enclosure is at least partially filled with a layer of optically transparent material that passes light utilized or generated by said optical integrated circuit. The enclosure can be preformed to a higher degree of precision than that obtainable on conventional packaging fabrication lines.
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