Method of securing an electrical sub-circuit assembly to a printed circuit board
    1.
    发明申请
    Method of securing an electrical sub-circuit assembly to a printed circuit board 失效
    将电子电路组件固定到印刷电路板的方法

    公开(公告)号:US20070096604A1

    公开(公告)日:2007-05-03

    申请号:US11223023

    申请日:2005-09-12

    CPC classification number: H05K1/183 H05K2201/10083

    Abstract: An electrical sub-circuit assembly is secured to a printed circuit board by providing a printed circuit board with a basin, the printed circuit board having electrical pathways leading to the top or side or on the bottom of said basin, and positioning an electrical sub-circuit assembly in the basin, the sub-circuit assembly having dimensions corresponding to the size of the basin so as to be a close fit therein and having electrical connections which locate adjacent corresponding electrical pathways on the printed circuit board. The sub-circuit assembly is secured in the basin, and the electrical connections on the sub-circuit assembly are connected to the corresponding pathways on the printed circuit board.

    Abstract translation: 通过提供具有盆的印刷电路板将电子电路组件固定到印刷电路板,印刷电路板具有通向所述盆的顶部或侧面或底部的电通路, 电路组件,子电路组件具有对应于盆的尺寸的尺寸,以便紧密配合在其中并且具有将印刷电路板上相邻的对应电路定位的电连接。 子电路组件固定在盆中,并且子电路组件上的电连接连接到印刷电路板上的相应路径。

Patent Agency Ranking