公开(公告)号：US08818265B2

公开(公告)日：2014-08-26

申请号：US13454815

申请日：2012-04-24

申请人： Peter Gerard Steeneken ,  Maarten Jacobus Swanenberg ,  Henk Boezen ,  Gerhard Koops ,  Frans Bontekoe ,  Reinout Woltjer

发明人： Peter Gerard Steeneken ,  Maarten Jacobus Swanenberg ,  Henk Boezen ,  Gerhard Koops ,  Frans Bontekoe ,  Reinout Woltjer

IPC分类号： H04B5/00 ,  H01L21/70 ,  H01L29/00 ,  H01L21/02 ,  H03K17/00 ,  H04B1/44

CPC分类号： H04B1/44 ,  H03K17/00

摘要： One or more embodiments provide circuitry for isolation and communication of signals between circuits operating in different voltage domains using capacitive coupling. The embodiments utilize capacitive structures having increased breakdown voltage in comparison to previous parallel plate implementations. The capacitive isolation is provided by parallel plate capacitive structures, each implemented to have parallel plates of different horizontal sizes. Due to the difference in horizontal size, edges of the parallel plates, where electric fields are the strongest, are laterally offset from the region where the parallel plates overlap. As a result, breakdown voltage between the parallel plates is increased.

摘要翻译： 一个或多个实施例提供用于使用电容耦合在不同电压域中工作的电路之间的信号的隔离和通信的电路。 与先前的平行板实现相比，这些实施例利用具有增加的击穿电压的电容结构。 电容隔离由平行板电容结构提供，每个电容结构被实现为具有不同水平尺寸的平行板。 由于水平尺寸的差异，电场最强的平行板的边缘与平行板重叠的区域横向偏移。 结果，平行板之间的击穿电压增加。

公开(公告)号：US20130281033A1

公开(公告)日：2013-10-24

申请号：US13454815

申请日：2012-04-24

申请人： Peter Gerard Steeneken ,  Maarten Jacobus Swanenberg ,  Henk Boezen ,  Gerhard Koops ,  Frans Bontekoe ,  Reinout Woltjer

发明人： Peter Gerard Steeneken ,  Maarten Jacobus Swanenberg ,  Henk Boezen ,  Gerhard Koops ,  Frans Bontekoe ,  Reinout Woltjer

IPC分类号： H04B1/44

CPC分类号： H04B1/44 ,  H03K17/00

摘要： One or more embodiments provide circuitry for isolation and communication of signals between circuits operating in different voltage domains using capacitive coupling. The embodiments utilize capacitive structures having increased breakdown voltage in comparison to previous parallel plate implementations. The capacitive isolation is provided by parallel plate capacitive structures, each implemented to have parallel plates of different horizontal sizes. Due to the difference in horizontal size, edges of the parallel plates, where electric fields are the strongest, are laterally offset from the region where the parallel plates overlap. As a result, breakdown voltage between the parallel plates is increased.

摘要翻译： 一个或多个实施例提供用于使用电容耦合在不同电压域中工作的电路之间的信号的隔离和通信的电路。 与先前的平行板实现相比，这些实施例利用具有增加的击穿电压的电容结构。 电容隔离由平行板电容结构提供，每个电容结构被实现为具有不同水平尺寸的平行板。 由于水平尺寸的差异，电场最强的平行板的边缘与平行板重叠的区域横向偏移。 结果，平行板之间的击穿电压增加。