Dynamic feedback electrostatic wafer chuck
    1.
    发明授权
    Dynamic feedback electrostatic wafer chuck 失效
    动态反馈静电晶片卡盘

    公开(公告)号:US5812361A

    公开(公告)日:1998-09-22

    申请号:US624988

    申请日:1996-03-29

    CPC分类号: H01L21/6833 Y10T279/23

    摘要: An electrostatic chuck system having an electrostatic chuck for securely holding a wafer on a surface of the electrostatic chuck. The electrostatic chuck system comprises a wafer bias sensor coupled to a first portion of the electrostatic chuck for sensing an alternating current signal at the first portion. The wafer bias sensor outputs, responsive to the alternating current signal, a direct current voltage level representative of a direct current bias level of the wafer. The electrostatic chuck system further comprises a variable electrostatic chuck power supply coupled to the wafer bias sensor. The variable electrostatic chuck power supply provides a first potential level to the first portion of the electrostatic chuck. The first potential level is modified, responsive to the direct current voltage level, to substantially maintain a first predefined potential difference between the first portion of the electrostatic chuck and a first region of the wafer overlaying the first portion irrespective of a magnitude of the direct current bias level of the wafer.

    摘要翻译: 一种具有用于将晶片牢固地保持在静电卡盘的表面上的静电卡盘的静电卡盘系统。 静电吸盘系统包括耦合到静电卡盘的第一部分的晶片偏置传感器,用于感测第一部分处的交流信号。 晶片偏置传感器响应于交流信号输出代表晶片的直流偏置电平的直流电压电平。 静电卡盘系统还包括耦合到晶片偏置传感器的可变静电卡盘电源。 可变静电卡盘电源为静电卡盘的第一部分提供第一电位电平。 响应于直流电压电平修改第一电位电平,以基本上保持静电卡盘的第一部分和覆盖第一部分的晶片的第一区域之间的第一预定电位差,而不管直流电流的大小 晶片的偏置电平。