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公开(公告)号：USD1030669S1
公开(公告)日：2024-06-11
申请号：US29777427
申请日：2021-04-06
Designer： Brian John Gillespie , Scott Michael Frye
Abstract: FIG. 1 is a front, top, and right perspective view of an electrical module showing our new design.
FIG. 2 is a front, top, and left perspective view thereof.
FIG. 3 is a rear, bottom, and right perspective view thereof.
FIG. 4 is a rear-bottom-left rear, bottom, and left perspective view thereof.
FIG. 5 is a right side view thereof.
FIG. 6 is a left side view thereof.
FIG. 7 is a front view thereof.
FIG. 8 is a rear view thereof.
FIG. 9 is a top view thereof.
FIG. 10 is a bottom view thereof.
FIG. 11 is a partial sectional view taken along line 11-11 of FIG. 7, the opposite view taken along line 11-11 being a mirror image thereof; and,
FIG. 12 is a partial sectional view taken along line 12-12 of FIG. 8, the opposite view taken along line 12-12 being a mirror image thereof.
The broken lines shown represent portions of the electrical module that form no part of the claimed design.-
公开(公告)号：USD1016763S1
公开(公告)日：2024-03-05
申请号：US29882592
申请日：2023-01-17
Designer： Brian John Gillespie , Scott Michael Frye
Abstract: FIG. 1 is an exploded front-top-right perspective view of an electrical housing showing our new design.
FIG. 2 is an exploded rear-top-right perspective view of the electrical housing shown in FIG. 1.
FIG. 3 is a front-top-right perspective view of the electrical housing of FIG. 1, shown with the covers attached.
FIG. 4 is a rear-top-right perspective view thereof.
FIG. 5 is a front view thereof.
FIG. 6 is a top view thereof.
FIG. 7 is a rear view thereof.
FIG. 8 is a bottom view thereof.
FIG. 9 is a right side view thereof; and,
FIG. 10 is a left side view thereof.
The broken lines in the drawings show portions of the electrical housing that form no part of the claimed design. The dot-dash lines showing the exploded structures in FIGS. 1 and 2 are shown for clarity of disclosure and indicate the path along which the removable covers have been exploded away from the remainder of the electrical housing and form no part of the claimed design.-
公开(公告)号：USD979518S1
公开(公告)日：2023-02-28
申请号：US29777422
申请日：2021-04-06
Designer： Brian John Gillespie , Scott Michael Frye
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公开(公告)号：US11516935B2
公开(公告)日：2022-11-29
申请号：US17087731
申请日：2020-11-03
Inventor： Scott Michael Frye , Brian John Gillespie , Christopher Michael Brink
Abstract: A method for maintaining continuity of a network signal path extending along a backplane includes providing a bypass signal circuit compatible with the network signal path and being electrically connected in series with the first and second portions of the network signal path. The bypass signal circuit includes a normally open circuit portion and an electrical contact movable with respect to the bypass signal circuit. An electrical contact is mechanically moved out of contact with the bypass signal circuit and moved mechanically into contact with the bypass signal circuit in response to the function module being detached from or attached to the function module electrical connector and not in response to an electrical control signal.
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公开(公告)号：US20210185846A1
公开(公告)日：2021-06-17
申请号：US16710767
申请日：2019-12-11
Inventor： David Nathan Katz , Davis Mathews , Jason Alan Norris , Brian John Gillespie
Abstract: A field device I/O connector includes a base and an I/O module removably mounted on the base for transmitting I/O signals along an I/O channel. A set of electrical connectors mounted on the base connect the base to a field device. The electrical connectors, the base, and the I/O module mounted on the base cooperate to define the I/O channel. The I/O channel includes a conversion circuit to convert between I/O signals and a digital data format output from the field device I/O connector. The base and I/O module also cooperate to define a diagnostic circuit connected to the portion of the I/O channel extending through the I/O module. The diagnostic circuit extends to a diagnostic logic circuit that may be included on the base, in the I/O module, or away from the field device I/O connector.
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Patent Agency Ranking
公开(公告)号：US11197386B2
公开(公告)日：2021-12-07
申请号：US16710767
申请日：2019-12-11
Inventor： David Nathan Katz , Davis Mathews , Jason Alan Norris , Brian John Gillespie
Abstract: A field device I/O connector includes a base and an I/O module removably mounted on the base for transmitting I/O signals along an I/O channel. A set of electrical connectors mounted on the base connect the base to a field device. The electrical connectors, the base, and the I/O module mounted on the base cooperate to define the I/O channel. The I/O channel includes a conversion circuit to convert between I/O signals and a digital data format output from the field device I/O connector. The base and I/O module also cooperate to define a diagnostic circuit connected to the portion of the I/O channel extending through the I/O module. The diagnostic circuit extends to a diagnostic logic circuit that may be included on the base, in the I/O module, or away from the field device I/O connector.
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公开(公告)号：US11093428B2
公开(公告)日：2021-08-17
申请号：US16733700
申请日：2020-01-03
Inventor： Brian John Gillespie , Davis Mathews
Abstract: A convertible I/O signal processor is convertible between different operating configurations for connecting multiple field devices to the I/O signal processor by selectable types of electrical connectors such as cables, terminal blocks, and the like. The I/O signal processor includes a signal processing module connected to a signal processor and an interface module removably connected to the signal processing module. The interface module includes electrical connectors for receiving/transmitting I/O signals from and to field devices. The interface module and the signal processing module define I/O channels extending between the electrical connectors and the signal processor. The interface module in embodiments includes I/O module connectors that enable removable I/O modules to be interposed in the I/O channels.
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公开(公告)号：US09727098B2
公开(公告)日：2017-08-08
申请号：US14676301
申请日：2015-04-01
Inventor： Brian John Gillespie , Terry Lee Barber , Michael Anthony Correll
CPC classification number: G06F1/184 , G06F1/181 , G06F1/185 , G06F1/188 , G06F1/189 , G06F1/26 , H01R13/62 , H01T4/06 , H05K7/14 , H05K7/1477 , H05K7/1482
Abstract: A redundant power supply motherboard assembly connects control segments of a fieldbus-type control system to a host computer. The assembly has a compact design with pairs of power supply modules in side-by-side nests on the motherboard. The nests are mounted on the motherboard in desired locations and securely hold the modules on the assembly despite vibrations, shocks and handling to prevent contact impairment. The nests provide touch protection for components on the motherboard.
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公开(公告)号：US20240056320A1
公开(公告)日：2024-02-15
申请号：US18269492
申请日：2022-02-23
Inventor： Lonnel J. Swarr , David N. Katz , Jason Alan Norris , Brian John Gillespie
IPC: H04L12/10
CPC classification number: H04L12/10
Abstract: An APL field switch includes a number of ports that transmit power to APL field devices connected to spurs extending from the ports. The APL Power Class of each port can be dynamically set by a user to enable more efficient allocation of power to the ports to meet the needs of the connected field devices.
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公开(公告)号：US20210209049A1
公开(公告)日：2021-07-08
申请号：US16733700
申请日：2020-01-03
Inventor： Brian John Gillespie , Davis Mathews
Abstract: A convertible I/O signal processor is convertible between different operating configurations for connecting multiple field devices to the I/O signal processor by selectable types of electrical connectors such as cables, terminal blocks, and the like. The I/O signal processor includes a signal processing module connected to a signal processor and an interface module removably connected to the signal processing module. The interface module includes electrical connectors for receiving/transmitting I/O signals from and to field devices. The interface module and the signal processing module define I/O channels extending between the electrical connectors and the signal processor. The interface module in embodiments includes I/O module connectors that enable removable I/O modules to be interposed in the I/O channels.
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