公开(公告)号：US07108476B2

公开(公告)日：2006-09-19

申请号：US10693296

申请日：2003-10-24

申请人： Pierre Astegno ,  Ekaterina Esteve ,  Alain Gaudon

发明人： Pierre Astegno ,  Ekaterina Esteve ,  Alain Gaudon

IPC分类号： B25J15/00 ,  B25J15/10 ,  B65B35/00

CPC分类号： H01L21/6835 ,  H01L21/68707 ,  Y10S414/136 ,  Y10S414/141

摘要： A mechanical apparatus and method are disclosed for orienting and positioning semiconductor wafers while avoiding contamination of elements on the faces thereof, by only contacting the peripheries thereof. The apparatus may include a frame for wafer supports and a semiconductor wafer gripping arm. The gripping arm is mounted on a translator for movement in X, Y, and Z directions to engage and move wafers in, from, and between supports. The gripping arm comprises a rigid structure with a plurality of semiconductor support wheels mounted thereon to support a wafer only around its periphery. A drive wheel is provided to orient a supported wafer rotationally while it is being supported around its periphery. A detector is provided to detect orientation of the wafer relative to a notch or other position mark on its periphery.

摘要翻译： 公开了一种用于定向和定位半导体晶片的机械装置和方法，同时通过仅接触其周边来避免元件在其表面上的污染。 该装置可以包括用于晶片支撑的框架和半导体晶片夹持臂。 夹持臂安装在一个平移器上，用于在X，Y和Z方向上移动，以便在支架之间，之间和之间移动晶片。 夹持臂包括刚性结构，其上安装有多个半导体支撑轮，以仅在其周边支撑晶片。 驱动轮被设置成在受支撑的晶片围绕其周边被支撑时旋转地定向支撑的晶片。 提供检测器以检测晶片相对于其周边上的凹口或其它位置标记的取向。

公开(公告)号：US06652216B1

公开(公告)日：2003-11-25

申请号：US09674613

申请日：2000-11-03

申请人： Pierre Astegno ,  Ekaterina Esteve ,  Alain Gaudon

发明人： Pierre Astegno ,  Ekaterina Esteve ,  Alain Gaudon

IPC分类号： H01L2100

CPC分类号： H01L21/6835 ,  H01L21/68707 ,  Y10S414/136 ,  Y10S414/141

摘要： A mechanical apparatus and method are disclosed for orienting and positioning semiconductor wafers while avoiding contamination of elements on the faces thereof, by only contacting the peripheries thereof. The apparatus may include a frame for wafer supports and a semiconductor wafer gripping arm. The gripping arm is mounted on a translator for movement in X, Y, and Z directions to engage and move wafers in, from, and between supports. The gripping arm comprises a, rigid structure with a plurality of semiconductor support wheels mounted thereon to support a wafer only around its periphery. A drive wheel is provided to orient a supported wafer rotationally while it is being supported around its periphery. A detector is provided to detect orientation of the wafer relative to a notch or other position mark on its periphery.

摘要翻译： 公开了一种用于定向和定位半导体晶片的机械装置和方法，同时通过仅接触其周边来避免元件在其表面上的污染。 该装置可以包括用于晶片支撑的框架和半导体晶片夹持臂。 夹持臂安装在一个平移器上，用于在X，Y和Z方向上移动，以便在支架之间，之间和之间移动晶片。 夹持臂包括刚性结构，其上安装有多个半导体支撑轮，以仅在其周边支撑晶片。 驱动轮被设置成在受支撑的晶片围绕其周边被支撑时旋转地定向支撑的晶片。 提供检测器以检测晶片相对于其周边上的凹口或其它位置标记的取向。