公开(公告)号：US07108476B2

公开(公告)日：2006-09-19

申请号：US10693296

申请日：2003-10-24

申请人： Pierre Astegno ,  Ekaterina Esteve ,  Alain Gaudon

发明人： Pierre Astegno ,  Ekaterina Esteve ,  Alain Gaudon

IPC分类号： B25J15/00 ,  B25J15/10 ,  B65B35/00

CPC分类号： H01L21/6835 ,  H01L21/68707 ,  Y10S414/136 ,  Y10S414/141

摘要： A mechanical apparatus and method are disclosed for orienting and positioning semiconductor wafers while avoiding contamination of elements on the faces thereof, by only contacting the peripheries thereof. The apparatus may include a frame for wafer supports and a semiconductor wafer gripping arm. The gripping arm is mounted on a translator for movement in X, Y, and Z directions to engage and move wafers in, from, and between supports. The gripping arm comprises a rigid structure with a plurality of semiconductor support wheels mounted thereon to support a wafer only around its periphery. A drive wheel is provided to orient a supported wafer rotationally while it is being supported around its periphery. A detector is provided to detect orientation of the wafer relative to a notch or other position mark on its periphery.

摘要翻译： 公开了一种用于定向和定位半导体晶片的机械装置和方法，同时通过仅接触其周边来避免元件在其表面上的污染。 该装置可以包括用于晶片支撑的框架和半导体晶片夹持臂。 夹持臂安装在一个平移器上，用于在X，Y和Z方向上移动，以便在支架之间，之间和之间移动晶片。 夹持臂包括刚性结构，其上安装有多个半导体支撑轮，以仅在其周边支撑晶片。 驱动轮被设置成在受支撑的晶片围绕其周边被支撑时旋转地定向支撑的晶片。 提供检测器以检测晶片相对于其周边上的凹口或其它位置标记的取向。

公开(公告)号：US06652216B1

公开(公告)日：2003-11-25

申请号：US09674613

申请日：2000-11-03

申请人： Pierre Astegno ,  Ekaterina Esteve ,  Alain Gaudon

发明人： Pierre Astegno ,  Ekaterina Esteve ,  Alain Gaudon

IPC分类号： H01L2100

CPC分类号： H01L21/6835 ,  H01L21/68707 ,  Y10S414/136 ,  Y10S414/141

摘要： A mechanical apparatus and method are disclosed for orienting and positioning semiconductor wafers while avoiding contamination of elements on the faces thereof, by only contacting the peripheries thereof. The apparatus may include a frame for wafer supports and a semiconductor wafer gripping arm. The gripping arm is mounted on a translator for movement in X, Y, and Z directions to engage and move wafers in, from, and between supports. The gripping arm comprises a, rigid structure with a plurality of semiconductor support wheels mounted thereon to support a wafer only around its periphery. A drive wheel is provided to orient a supported wafer rotationally while it is being supported around its periphery. A detector is provided to detect orientation of the wafer relative to a notch or other position mark on its periphery.

摘要翻译： 公开了一种用于定向和定位半导体晶片的机械装置和方法，同时通过仅接触其周边来避免元件在其表面上的污染。 该装置可以包括用于晶片支撑的框架和半导体晶片夹持臂。 夹持臂安装在一个平移器上，用于在X，Y和Z方向上移动，以便在支架之间，之间和之间移动晶片。 夹持臂包括刚性结构，其上安装有多个半导体支撑轮，以仅在其周边支撑晶片。 驱动轮被设置成在受支撑的晶片围绕其周边被支撑时旋转地定向支撑的晶片。 提供检测器以检测晶片相对于其周边上的凹口或其它位置标记的取向。

公开(公告)号：US07030401B2

公开(公告)日：2006-04-18

申请号：US10257776

申请日：2001-04-12

申请人： Michael Abraham ,  Ivo J M M Raaijmakers ,  Alain Gaudon ,  Pierre Astegno

发明人： Michael Abraham ,  Ivo J M M Raaijmakers ,  Alain Gaudon ,  Pierre Astegno

IPC分类号： G01N21/86 ,  B63H11/00

CPC分类号： H01L21/67178 ,  H01L21/67167 ,  H01L21/67173 ,  H01L21/67259 ,  H01L21/681 ,  Y10T29/49004 ,  Y10T29/53187

摘要： A substrate measurement system including a measurement chamber and a substrate handling chamber possessing a substrate transfer and a substrate container interface arranged to receive a substrate to container. The handling chamber contains a first interface to connect the measurement chamber and the measurement chamber contains a second interface to connect the handling chamber. The transfer means is arranged to transfer substrates between the container and the measurement chamber through the handling chamber, in which system a second measurement chamber is provided, having the same second interface as the first measurement chamber to replace latter chamber.

摘要翻译： 一种基板测量系统，包括测量室和具有基板转印的基板处理室和布置成将基板接收到容器的基板容器接口。 处理室包含用于连接测量室的第一界面，并且测量室包含连接处理室的第二界面。 传送装置被布置成通过处理室在容器和测量室之间传送基板，其中设置有第二测量室，该第二测量室具有与第一测量室相同的第二界面以替换后一个室。

公开(公告)号：US06961639B2

公开(公告)日：2005-11-01

申请号：US10353845

申请日：2003-01-28

申请人： Alain Gaudon ,  Pierre Astegno ,  Mohammed El Jarjini

发明人： Alain Gaudon ,  Pierre Astegno ,  Mohammed El Jarjini

IPC分类号： G06K9/20 ,  G06K7/10 ,  G06F7/00

CPC分类号： G06K7/10861 ,  Y10S414/136 ,  Y10S414/141

摘要： A device and process are provided for identifying characters inscribed on a semiconductor wafer containing an orientation mark. A semiconductor wafer having characters inscribed on a surface near its periphery is supported about its periphery between three rotary supports mounted on a grasping arm. An orientation mark on the periphery of the wafer is located adjacent the inscribed characters. At least one of the three rotary supports is rotatably driven to orient the wafer such that the orientation mark is placed in a determined position. An optical reflector is positioned in a spatial zone in proximity to and above the characters to be identified. The characters to be identified are illuminated by a light beam reflected by the optical reflector. The characters reflect the light, which may be observed by an optical imager, such as a camera. An optical recognition subsystem may then be used to identify the characters.

摘要翻译： 提供了用于识别内含在包含取向标记的半导体晶片上的字符的装置和工艺。 具有在其周边附近的表面上刻有字符的半导体晶片围绕安装在抓握臂上的三个旋转支架之间的周边被支撑。 在晶片周边上的取向标记位于相邻的内切字符处。 三个旋转支撑件中的至少一个被可旋转地驱动以使晶片定向，使得定向标记被放置在确定的位置。 光学反射器位于靠近和要被识别的字符之上的空间区域中。 待识别的字符由光反射器反射的光束照射。 这些字符反映光，可以通过诸如相机的光学成像器来观察。 然后可以使用光学识别子系统来识别字符。

公开(公告)号：US07244088B2

公开(公告)日：2007-07-17

申请号：US10734723

申请日：2003-12-12

申请人： Christophe Lero ,  Pierre Astegno ,  Alain Gaudon

发明人： Christophe Lero ,  Pierre Astegno ,  Alain Gaudon

IPC分类号： B65G49/07

CPC分类号： H01L21/67766 ,  B23Q7/043 ,  B23Q11/08 ,  H01L21/68707 ,  Y10S414/135

摘要： A device (12) picks up at least one semi-conductor wafer (11) from a container (14) of wafers fitted on one side (15) of an aperture (13) in the transfer station (10) of a semi-conductor wafer processing plant. The device is on the opposite side (17) of the aperture and the pick-up is effected through it. The device incorporates a shutter (1) movable between open and closed positions. A wafer picking up means (2) is attached to the shutter and is designed to enter partially within the container below a wafer and seize the wafer by its edge. A pick up moving means (3) moves the picking up means (2) back and forth through the aperture (13).

摘要翻译： 装置（12）从安装在半导体的转移站（10）中的孔（13）的一侧（15）上的晶片的容器（14）中拾取至少一个半导体晶片（11） 晶圆加工厂。 该装置位于孔的相对侧（17）上，并通过它进行拾取。 该装置包括可在打开位置和关闭位置之间移动的快门（1）。 晶片拾取装置（2）附接到闸门，并被设计成部分地在晶片下面的容器内部进入并通过其边缘抓住晶片。 拾取移动装置（3）通过孔（13）来回移动拾取装置（2）。

公开(公告)号：US06420864B1

公开(公告)日：2002-07-16

申请号：US09548773

申请日：2000-04-13

申请人： Michael Abraham ,  Ivo J. M. M. Raaijmakers ,  Alain Gaudon ,  Pierre Astegno

发明人： Michael Abraham ,  Ivo J. M. M. Raaijmakers ,  Alain Gaudon ,  Pierre Astegno

IPC分类号： G01R3126

CPC分类号： H01L21/6719 ,  H01L21/67196

摘要： Substrate measurement system including a measurement chamber (30), and a substrate handling chamber (7) possessing substrate transfer means (10) and a substrate container interface (1) arranged to receive a substrate container (8), the handling chamber (7) containing an interface (50) to connect the measurement chamber (30), the measurement chamber (30) containing an interface (51) to connect to the handling chamber (7), and the transfer means (10) being arranged to transfer substrates between the container (8) and the measurement chamber (30) through the handling chamber (7), in which a second measurement chamber (39) is provided, having the same interface (51) as the first measurement chamber (30) to replace the latter chamber (30).

摘要翻译： 基板测量系统包括测量室（30）和具有基板传送装置（10）的基板处理室（7）和布置成容纳基板容器（8）的基板容器接口（1），处理室（7） 包括用于连接测量室（30）的接口（50），包含连接到处理室（7）的接口（51）的测量室（30），以及传送装置（10） 通过处理室（7）的容器（8）和测量室（30），其中设有第二测量室（39），其具有与第一测量室（30）相同的界面（51） 后室（30）。

公开(公告)号：US20050063797A1

公开(公告)日：2005-03-24

申请号：US10734723

申请日：2003-12-12

申请人： Christophe Lero ,  Pierre Astegno ,  Alain Gaudon

发明人： Christophe Lero ,  Pierre Astegno ,  Alain Gaudon

IPC分类号： B23Q7/04 ,  B23Q11/08 ,  H01L21/677 ,  H01L21/687 ,  B65G1/00

CPC分类号： H01L21/67766 ,  B23Q7/043 ,  B23Q11/08 ,  H01L21/68707 ,  Y10S414/135

摘要： A device (12) to pick up at least one disc-shaped semi-conductor wafer (11) from a container (14) of such wafers fitted on one side (15) of an aperture (13) in the transfer station (10) of a semi-conductor wafer processing plant, the device being situated on the opposite side (17) of the said aperture and the pick-up being effected through it. The device incorporates: A moving shutter (1) designed to move between a first, closed aperture, position and a second, open aperture, position that allows access to the inside of the container. A means of moving (18) this shutter between these first and second positions, the said movement taking place, at least in part, in a plane approximately parallel to the plane of the aperture. The said device may be defined as including: Some means of picking up (2) at least one semi-conductor wafer (11) that is designed to enter partially within the said container below a wafer and seize this latter by its edge, Some means of moving (3) the said pick-ups between the said space on the second side of the aperture and the first side, and back again, Some means of attaching (4) the said pick-up mechanism to the shutter.

摘要翻译： 一种装置（12），用于从装配在转印站（10）中的孔（13）的一侧（15）上的这种晶片的容器（14）拾取至少一个盘形半导体晶片（11） 的半导体晶片处理设备，所述设备位于所述孔的相对侧（17）上，并且所述拾取器通过其进行。 该装置包括：移动快门（1），其被设计成在允许进入容器内部的第一，闭合孔径，位置和第二开口孔之间移动。 在这些第一和第二位置之间移动（18）该快门的装置，所述运动至少部分地在大致平行于孔的平面的平面中发生。 所述装置可以被定义为包括：一些拾取（2）至少一个半导体晶片（11）的装置，所述半导体晶片被设计成部分地在所述容器的下面部分地进入晶片下方并且通过其边缘将其卡住。 在所述孔的第二侧的所述空间和所述第一侧之间移动（3）所述拾取器，并且再次返回。将所述拾取机构附接（4）到所述挡板的一些装置。