公开(公告)号：US20060232886A1

公开(公告)日：2006-10-19

申请号：US11425666

申请日：2006-06-21

申请人： Ping-Wei Chang ,  Brad Jackson ,  Bulent Kurdi ,  Jennifer Lu ,  Dennis McKean ,  Eun Row

发明人： Ping-Wei Chang ,  Brad Jackson ,  Bulent Kurdi ,  Jennifer Lu ,  Dennis McKean ,  Eun Row

IPC分类号： G11B5/60

CPC分类号： G11B5/6082 ,  G11B5/3173

摘要： A process to reduce step heights in planarization of thin film carriers in an encapsulation system. The improvements include using an adhesive tape having a thinner adhesive thickness and a stiffer tape for the film sealing the encapsulant on the carrier to result in a low step height surface transition between the carrier and the cured encapsulant. The composition of the encapsulant is modified to reduce the shrinkage upon curing of the encapsulant. The encapsulant may include an absorbent that absorbs the irradiation and cause the top surface to harden first compared to the bulk of the encapsulant, and/or a gas-emitting additive that creates gaseous products that expand upon irradiation to thereby reduce the shrinkage of the encapsulant upon curing. Alternatively, irradiation at very low incidence angle relative to the top surface of the encapsulant causes the top surface to harden before the bulk of the encapsulant.

摘要翻译： 一种降低封装系统中薄膜载体平面化阶跃高度的方法。 这些改进包括使用具有较薄粘合剂厚度的粘合带和用于将密封剂密封在载体上的较硬的胶带，导致载体和固化的密封剂之间的低台阶高度表面过渡。 改进密封剂的组成以减少密封剂固化时的收缩。 密封剂可以包括吸收辐射的吸收剂，并且使顶部表面首先与密封剂的主体相比硬化，和/或产生气体产物的气体发射添加剂，其在照射时膨胀，从而减小密封剂的收缩 固化后。 或者，相对于密封剂的顶表面以非常低的入射角照射导致顶表面在大部分密封剂之前硬化。