Sensor package having a movable sensor

    公开(公告)号:US11465901B2

    公开(公告)日:2022-10-11

    申请号:US17091062

    申请日:2020-11-06

    Abstract: A sensor package including a fixed frame, a moveable platform, elastic restoring members and a sensor chip is provided. The moveable platform is moved with respect to the fixed frame, and used to carry the sensor chip. The elastic restoring members are connected between the fixed frame and the moveable platform, and used to restore the moved moveable platform to an original position. The sensor chip is arranged on the elastic restoring members to send detected data via the elastic restoring members.

    Sensor package having a movable sensor

    公开(公告)号:US10589982B2

    公开(公告)日:2020-03-17

    申请号:US16448612

    申请日:2019-06-21

    Abstract: A sensor package including a fixed frame, a moveable platform, elastic restoring members and a sensor chip is provided. The moveable platform is moved with respect to the fixed frame, and used to carry the sensor chip. The elastic restoring members are connected between the fixed frame and the moveable platform, and used to restore the moved moveable platform to an original position. The sensor chip is arranged on the elastic restoring members to send detected data via the elastic restoring members.

    Sensor package having a movable sensor

    公开(公告)号:US10858238B2

    公开(公告)日:2020-12-08

    申请号:US16783627

    申请日:2020-02-06

    Abstract: A sensor package including a fixed frame, a moveable platform, elastic restoring members and a sensor chip is provided. The moveable platform is moved with respect to the fixed frame, and used to carry the sensor chip. The elastic restoring members are connected between the fixed frame and the moveable platform, and used to restore the moved moveable platform to an original position. The sensor chip is arranged on the elastic restoring members to send detected data via the elastic restoring members.

    SENSOR PACKAGE HAVING A MOVABLE SENSOR
    5.
    发明申请

    公开(公告)号:US20190308872A1

    公开(公告)日:2019-10-10

    申请号:US16448612

    申请日:2019-06-21

    Abstract: A sensor package including a fixed frame, a moveable platform, elastic restoring members and a sensor chip is provided. The moveable platform is moved with respect to the fixed frame, and used to carry the sensor chip. The elastic restoring members are connected between the fixed frame and the moveable platform, and used to restore the moved moveable platform to an original position. The sensor chip is arranged on the elastic restoring members to send detected data via the elastic restoring members.

    Manufacturing method of sensor package

    公开(公告)号:US10384928B1

    公开(公告)日:2019-08-20

    申请号:US15891975

    申请日:2018-02-08

    Abstract: A sensor package including a fixed frame, a moveable platform, elastic restoring members and a sensor chip is provided. The moveable platform is moved with respect to the fixed frame, and used to carry the sensor chip. The elastic restoring members are connected between the fixed frame and the moveable platform, and used to restore the moved moveable platform to an original position. The sensor chip is arranged on the elastic restoring members to send detected data via the elastic restoring members.

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