THICK ROUTING LINES IN DARK TRENCHES
    1.
    发明申请
    THICK ROUTING LINES IN DARK TRENCHES 审中-公开
    在深蓝色的粗线路

    公开(公告)号:US20160351135A1

    公开(公告)日:2016-12-01

    申请号:US14724410

    申请日:2015-05-28

    CPC classification number: G09G3/3433 G02B26/04 G09G3/20 G09G2360/144

    Abstract: Implementations described herein relate to display devices including a metal circuit layer embedded in a dielectric layer configured to provide optical properties. Trenches in the dielectric layer may be etched so that the thickness of the metal circuit layer may extend away from other circuit layers. In some implementations, the metal circuit layer can include thick metal routing lines to send data to pixels of the display device. The thick metal routing lines can provide high conductivity, minimal voltage drop, and signal speed that is sufficiently high to write data to many pixels over long distances. In some implementations, the dielectric layer can be configured to absorb light. Examples of such dielectric layers include carbon-doped spin-on-glass dielectric layers.

    Abstract translation: 本文所述的实施方式涉及显示装置,其包括嵌入介质层中的金属电路层,该电介质层被配置为提供光学性质。 可以蚀刻电介质层中的沟槽,使得金属电路层的厚度可以远离其它电路层延伸。 在一些实施方式中,金属电路层可以包括用于向显示装置的像素发送数据的粗金属布线线。 厚金属布线线可以提供足够高的高导电率,最小电压降和信号速度,以便在长距离上将数据写入许多像素。 在一些实施方式中,电介质层可被配置成吸收光。 这种介电层的实例包括碳掺杂的旋涂玻璃介电层。

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