公开(公告)号：US10299405B2

公开(公告)日：2019-05-21

申请号：US15722035

申请日：2017-10-02

Applicant: Plume Design, Inc.

Inventor： Richard Tzewei Chang ,  Yoseph Malkin ,  Patrick Hanley ,  Jeffrey ChiFai Liew ,  Liem Hieu Dinh Vo ,  Duc Minh Nguyen ,  Nora Yan ,  Hiroshi Mendoza ,  William McFarland

IPC: H05K7/20 ,  H05K1/14 ,  H05K1/11

Abstract: An electronic device includes a first circuit board and a second circuit board each stacked relative to one another; and a mid-spreader disposed between the first circuit board and the second circuit board, wherein the mid-spreader includes a heat conductive material in thermal contact with one or more components on each of the first circuit board and the second circuit board to act as a heat sink, and wherein the mid-spreader is thermally connected to one or more heat sinks, the mid-spreader is one of disposed to or integrally formed with the one or more heat sinks, and the mid-spreader extends beyond a size of at least one of the first circuit board and the second circuit board to conduct and transfer heat therefrom.

公开(公告)号：US10431868B2

公开(公告)日：2019-10-01

申请号：US15603650

申请日：2017-05-24

Applicant: Plume Design, Inc.

Inventor： Miroslav Samardzija ,  William McFarland ,  Jeffrey ChiFai Liew ,  Patrick Hanley ,  Yoseph Malkin ,  Richard Tzewei Chang ,  Duc Minh Nguyen ,  Liem Hieu Dinh Vo

IPC: H01Q1/42 ,  H01Q1/02 ,  H01Q1/48 ,  H01Q1/00 ,  H01Q1/36 ,  H01Q1/38 ,  H01Q1/44 ,  H01Q9/42 ,  H01Q13/10 ,  H01Q21/06 ,  H01Q21/28

Abstract: An antenna system reusing metallic components in a device includes a first antenna element which is also configured to transfer heat into surrounding air; a ground plane which is part of reused metallic components in the device for heat dissipation; and a first physical connection between the first antenna element and the ground plane which supports thermal conductivity based on an associated size and material of the first physical connection.