公开(公告)号：US20240222220A1

公开(公告)日：2024-07-04

申请号：US18147681

申请日：2022-12-28

Applicant: Plume Design, Inc.

Inventor： Ming-Tsung Su ,  Yuhan Liu

IPC: H01L23/367 ,  H01L23/373 ,  H01L23/40 ,  H01L23/42 ,  H01L23/60

CPC classification number: H01L23/367 ,  H01L23/3736 ,  H01L23/4093 ,  H01L23/42 ,  H01L23/60

Abstract: A heat sink assembly for dissipating heat in a chipset comprising a shield cover having a void and a heat sink that at least partially fills the void in the shield cover. The heat sink protruding through the shield cover and pressed against the chipset with a single layer thermal pad between. The heat sink assembly including a shielding wall consisting of a plurality of elastic spring fingers, the spring fingers arranged around the periphery of the shielding wall base and in contact with the heat sink and the shield cover wherein the shielding wall encircles the chipset and is positioned between the shield cover and the heat sink. The shielding wall providing Electromagnetic Interference (EMI) and noise shielding in addition to optimizing thermal convection for the chipset.