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1.发明授权公开(公告)号：US07226531B2
公开(公告)日：2007-06-05
申请号：US11298523
申请日：2005-12-12
申请人： Po-Yuan Lo , Jung-Hua Wei , Bae-Horng Chen , Jih-Shun Chiang , Chian-Liang Hwang , Ming-Jer Kao
发明人： Po-Yuan Lo , Jung-Hua Wei , Bae-Horng Chen , Jih-Shun Chiang , Chian-Liang Hwang , Ming-Jer Kao
摘要： Method of making an electroplated interconnection wire of a composite of metal and carbon nanotubes is disclosed, including electroplating a substrate having a conductive baseline on a surface thereof in an electroplating bath containing a metal ion and carbon nanotubes, so that an electroplated interconnection wire of a composite of the metal and carbon nanotubes is formed on the conductive baseline. Alternatively, a method of the present invention includes preparing a dispersion of carbon nanotubes dispersed in an organic solvent, printing a baseline with the dispersion on a surface of a substrate, evaporating the organic solvent to obtain a conductive baseline, and electroplating the surface in an electroplating bath containing a metal ion, so that an electroplated interconnection wire of a composite of the metal and carbon nanotubes is formed on the conductive baseline.
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2.发明申请Method of making an electroplated interconnection wire of a composite of metal and carbon nanotubes 有权制造金属和碳纳米管复合材料的电镀互连线的方法公开(公告)号：US20070056855A1
公开(公告)日：2007-03-15
申请号：US11298523
申请日：2005-12-12
申请人： Po-Yuan Lo , Jung-Hua Wei , Bae-Horng Chen , Jih-Shun Chiang , Chian-Liang Hwang , Ming-Jer Kao
发明人： Po-Yuan Lo , Jung-Hua Wei , Bae-Horng Chen , Jih-Shun Chiang , Chian-Liang Hwang , Ming-Jer Kao
IPC分类号： C25D1/04
摘要： Method of making an electroplated interconnection wire of a composite of metal and carbon nanotubes is disclosed, including electroplating a substrate having a conductive baseline on a surface thereof in an electroplating bath containing a metal ion and carbon nanotubes, so that an electroplated interconnection wire of a composite of the metal and carbon nanotubes is formed on the conductive baseline. Alternatively, a method of the present invention includes preparing a dispersion of carbon nanotubes dispersed in an organic solvent, printing a baseline with the dispersion on a surface of a substrate, evaporating the organic solvent to obtain a conductive baseline, and electroplating the surface in an electroplating bath containing a metal ion, so that an electroplated interconnection wire of a composite of the metal and carbon nanotubes is formed on the conductive baseline.
摘要翻译： 公开了一种制造金属和碳纳米管复合材料的电镀互连线的方法，包括在含有金属离子和碳纳米管的电镀浴中在其表面上电镀具有导电基线的基片，使得电镀互连线 在导电基线上形成金属和碳纳米管的复合物。 或者，本发明的方法包括制备分散在有机溶剂中的碳纳米管的分散体，将基质与分散体印刷在基材的表面上，蒸发有机溶剂以获得导电基线，并将表面电镀在 含有金属离子的电镀浴，使得在导电基线上形成金属和碳纳米管的复合材料的电镀互连线。
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公开(公告)号：US20070155064A1
公开(公告)日：2007-07-05
申请号：US11430938
申请日：2006-05-10
申请人： Bae-Horng Chen , Jeng-Hua Wei , Po-Yuan Lo , Zing-Way Pei
发明人： Bae-Horng Chen , Jeng-Hua Wei , Po-Yuan Lo , Zing-Way Pei
IPC分类号： H01L21/8232 , H01L21/335
CPC分类号： H01L51/0048 , B82Y10/00 , H01L51/002 , H01L51/0545 , H01L51/0558
摘要： A method for manufacturing a carbon nano-tube field-effect transistor (CNT-FET), comprising steps of: forming a patterned conductive layer on a substrate; forming a dielectric layer covering the conductive layer and the substrate; forming a carbon nano-tube layer between a pair of electrodes on the dielectric layer; and performing a treatment process on the carbon nano-tube layer so that the carbon nano-tube layer is semiconducting.
摘要翻译： 一种制造碳纳米管场效应晶体管（CNT-FET）的方法，包括以下步骤：在衬底上形成图案化的导电层; 形成覆盖所述导电层和所述基板的电介质层; 在介电层上的一对电极之间形成碳纳米管层; 并对碳纳米管层进行处理工艺，使得碳纳米管层是半导体的。
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