OVER-CURRENT PROTECTION DEVICE
    1.
    发明公开

    公开(公告)号:US20240177893A1

    公开(公告)日:2024-05-30

    申请号:US18311723

    申请日:2023-05-03

    IPC分类号: H01C7/02 H01C1/14

    CPC分类号: H01C7/027 H01C1/1406

    摘要: An over-current protection device includes a heat-sensitive layer and an electrode layer. The electrode layer includes a top metal layer and a bottom metal layer, and the heat-sensitive layer attached therebetween. The heat-sensitive layer exhibits a positive temperature coefficient (PTC) characteristic and includes a polymer matrix and a conductive filler. The polymer matrix includes a polyolefin-based homopolymer and a polyolefin-based copolymer. The polyolefin-based homopolymer has a first coefficient of thermal expansion (CTE), and the polyolefin-based copolymer has a second CTE lower than the first CTE. The polyolefin-based homopolymer and the polyolefin-based copolymer together form an interpenetrating polymer network (IPN).

    OVER-CURRENT PROTECTION DEVICE
    3.
    发明公开

    公开(公告)号:US20240145133A1

    公开(公告)日:2024-05-02

    申请号:US18295919

    申请日:2023-04-05

    IPC分类号: H01C7/02 H01C7/13

    CPC分类号: H01C7/028 H01C7/021 H01C7/13

    摘要: An over-current protection device includes a first metal layer, a second metal layer and a heat-sensitive layer laminated therebetween. The heat-sensitive layer exhibits a positive temperature coefficient (PTC) characteristic and includes a polymer matrix and a first conductive filler. The polymer matrix includes a polyolefin-based polymer and a fluoropolymer. The fluoropolymer has a melt flow index higher than 1.9 g/10 min, and the polyolefin-based polymer and the fluoropolymer together form an interpenetrating polymer network (IPN). The first conductive filler has a metal-ceramic compound dispersed in the polymer matrix.

    OVER-CURRENT PROTECTION DEVICE
    4.
    发明公开

    公开(公告)号:US20240127988A1

    公开(公告)日:2024-04-18

    申请号:US18177681

    申请日:2023-03-02

    IPC分类号: H01C7/02

    CPC分类号: H01C7/021 H01C7/028

    摘要: An over-current protection device includes a first metal layer, a second metal layer and a heat-sensitive layer laminated therebetween. The heat-sensitive layer exhibits a positive temperature coefficient (PTC) characteristic and includes a first polymer and a conductive filler. The first polymer consists of polyvinylidene difluoride (PVDF), and PVDF exists in different phases such as α-PVDF, β-PVDF and γ-PVDF. The total amount of α-PVDF, β-PVDF and γ-PVDF is calculated as 100%, and the amount of α-PVDF accounts for 48% to 55%. The conductive filler has a metal-ceramic compound.