公开(公告)号：US20240145133A1

公开(公告)日：2024-05-02

申请号：US18295919

申请日：2023-04-05

申请人： Polytronics Technology Corp.

发明人： CHEN-NAN LIU ,  YUNG-HSIEN CHANG ,  CHENG-YU TUNG ,  HSIU-CHE YEN ,  Chia-Yuan LEE ,  Yao-Te CHANG ,  FU-HUA CHU

IPC分类号： H01C7/02 ,  H01C7/13

CPC分类号： H01C7/028 ,  H01C7/021 ,  H01C7/13

摘要： An over-current protection device includes a first metal layer, a second metal layer and a heat-sensitive layer laminated therebetween. The heat-sensitive layer exhibits a positive temperature coefficient (PTC) characteristic and includes a polymer matrix and a first conductive filler. The polymer matrix includes a polyolefin-based polymer and a fluoropolymer. The fluoropolymer has a melt flow index higher than 1.9 g/10 min, and the polyolefin-based polymer and the fluoropolymer together form an interpenetrating polymer network (IPN). The first conductive filler has a metal-ceramic compound dispersed in the polymer matrix.

公开(公告)号：US20240127988A1

公开(公告)日：2024-04-18

申请号：US18177681

申请日：2023-03-02

申请人： Polytronics Technology Corp.

发明人： HSIU-CHE YEN ,  YUNG-HSIEN CHANG ,  CHENG-YU TUNG ,  Chia-Yuan Lee ,  CHEN-NAN LIU ,  Yao-Te Chang ,  FU-HUA CHU

IPC分类号： H01C7/02

CPC分类号： H01C7/021 ,  H01C7/028

摘要： An over-current protection device includes a first metal layer, a second metal layer and a heat-sensitive layer laminated therebetween. The heat-sensitive layer exhibits a positive temperature coefficient (PTC) characteristic and includes a first polymer and a conductive filler. The first polymer consists of polyvinylidene difluoride (PVDF), and PVDF exists in different phases such as α-PVDF, β-PVDF and γ-PVDF. The total amount of α-PVDF, β-PVDF and γ-PVDF is calculated as 100%, and the amount of α-PVDF accounts for 48% to 55%. The conductive filler has a metal-ceramic compound.

公开(公告)号：US20240071656A1

公开(公告)日：2024-02-29

申请号：US18154599

申请日：2023-01-13

申请人： Polytronics Technology Corp.

发明人： Chien Hui WU ,  Yung-Hsien CHANG ,  Cheng-Yu TUNG ,  Ming-Hsun LU ,  Yi-An SHA

IPC分类号： H01C7/02 ,  H01C1/01 ,  H01C1/14

CPC分类号： H01C7/021 ,  H01C1/01 ,  H01C1/1406

摘要： A circuit protection device includes a first temperature sensitive resistor, a second temperature sensitive resistor, an electrically insulating multilayer, a first and second electrode layer, and at least one external electrode. The first temperature sensitive resistor and the second temperature sensitive resistor are electrically connected in parallel, and have a first upper electrically conductive layer and a second lower electrically conductive layer, respectively. The electrically insulating multilayer includes an upper insulating layer, a middle insulating layer, and a lower insulating layer. The upper insulating layer is between the first upper electrically conductive layer and the first electrode layer. The middle layer is laminated between the first temperature sensitive resistor and the second temperature sensitive resistor. The lower insulating layer is between the second lower electrically conductive layer and the second electrode layer. The external electrode is disposed on the first electrode layer, and extends beyond a peripheral wall along a horizontal direction.

公开(公告)号：US11626220B2

公开(公告)日：2023-04-11

申请号：US17471795

申请日：2021-09-10

申请人： Polytronics Technology Corp.

发明人： Feng Ji Li ,  Yi-Hsuan Lee ,  Yung Hsien Chang

IPC分类号： H01C7/02 ,  H01C1/14

摘要： A surface-mountable over-current protection device comprises at least one PTC material layer, a first conductive layer, a second conductive layer, a first electrode, a second electrode, an insulating layer, and a cover layer. The PTC material layer comprises crystalline polymer and conductive fillers dispersed therein. The first conductive layer and the second conductive layer are disposed on a first surface and a second surface of the PTC material layer, respectively. The first electrode and the second electrode are electrically connected to the first conductive layer and the second conductive layer, respectively. The insulating layer is disposed between the first electrode and the second electrode for insulation. The cover layer includes a fluorine-containing polymer, and wraps around an entire outer surface of the surface-mountable over-current protection device.

公开(公告)号：US20220201856A1

公开(公告)日：2022-06-23

申请号：US17188528

申请日：2021-03-01

申请人： Polytronics Technology Corp.

发明人： KUO HSUN CHEN ,  Cheng Tsung Yang ,  Feng-Chun Yu ,  KAI-WEI LO

IPC分类号： H05K1/05 ,  H01L23/373

摘要： A thermally conductive board includes a metal substrate, a metal layer, a thermal conductive insulating polymer layer, and a ceramic material layer. The thermal conductive insulating polymer layer is located between the metal layer and the metal substrate. The ceramic material layer includes an upper ceramic layer or a lower ceramic layer, or includes both the upper ceramic layer and the lower ceramic layer. The upper ceramic layer is disposed between the metal layer and the thermal conductive insulating polymer layer, and the lower ceramic layer is disposed between the thermal conductive insulating polymer layer and the metal substrate.

公开(公告)号：US11018502B2

公开(公告)日：2021-05-25

申请号：US16290279

申请日：2019-03-01

申请人： Polytronics Technology Corp.

发明人： Zhen Yu Dong ,  Yung Hsien Chang ,  Hsiu Che Yen ,  Yao Te Chang ,  Pin Syuan Li

IPC分类号： H01C7/02 ,  H02H9/02 ,  H01R107/00 ,  H01R24/60 ,  H01H1/04 ,  H01C7/10 ,  H02H5/04

摘要： A cable comprises a power conductor, a data conductor and a first PTC device. The power conductor is configured to transmit electrical power between a source and a sink. The data conductor is configured to transmit data between the source and the sink. The first PTC device is coupled to the data conductor and its resistance increases drastically to decrease current flowing through the data conductor if a temperature of the first PTC device exceeds a first trip temperature. The first trip temperature is 55-80° C. The resistance of the PTC device is larger than 20 kΩ at 85° C. and larger than 80 kΩ at 100° C. A current flowing through the data conductor does not exceed 20 mA.

公开(公告)号：US20210059056A1

公开(公告)日：2021-02-25

申请号：US16844566

申请日：2020-04-09

申请人： Polytronics Technology Corp.

发明人： Kuo-Hsun CHEN ,  Chia-Hsiung Wu ,  Kai-Wei LO ,  Yu-Hsuan Tseng

IPC分类号： H05K3/06 ,  H05K3/26

摘要： A thermally conductive board comprises a metal substrate, a foil containing copper, a thermally conductive and insulating layer and a barrier layer. The thermally conductive and electrically insulating layer is disposed on the metal substrate. The barrier layer is laminated between the foil containing copper and the thermally conductive and electrically insulating layer. The barrier is in direct contact with the foil containing copper, and the interface between the barrier layer and the foil containing copper comprises a microrough surface. The barrier layer has a Redox potential between 0 and −1V. The microrough surface has a roughness Rz of 2-18 μm.

公开(公告)号：US10804013B2

公开(公告)日：2020-10-13

申请号：US16589704

申请日：2019-10-01

申请人： Polytronics Technology Corp.

发明人： Chun-Teng Tseng ,  David Shau Chew Wang

IPC分类号： H01C1/14 ,  H01C7/13 ,  H02H9/02 ,  H01C7/02

摘要： An over-current protection device is a hexahedron comprising an upper surface, a lower surface and four lateral surfaces. The over-current protection device comprises a PTC device, a first insulating layer, a first electrode layer and a second electrode layer. The PTC device comprises a first conductive layer, a second conductive layer and a PTC material layer laminated therebetween. The first conductive layer comprises a first conductive section and a second conductive section separated by at least one trench. The first insulating layer is disposed on the first conductive layer. The first electrode layer is disposed on the first insulating layer and electrically coupled to the first conductive section. The second electrode layer is disposed on the first insulating layer and electrically coupled to the second conductive section. The trench comprises a primary portion not parallel to a longitudinal direction of the first and second electrode layers.

公开(公告)号：US10395876B1

公开(公告)日：2019-08-27

申请号：US16290317

申请日：2019-03-01

申请人： Polytronics Technology Corp.

发明人： Tsung Min Su ,  Chia Mao Chen ,  David Shau Chew Wang

IPC分类号： H01H85/00 ,  H01H69/02 ,  H01H85/20 ,  H01H85/04 ,  H01H85/041

摘要： A protection device comprises a first planar substrate, a second planar substrate, a heater and a fusible element. The first planar substrate comprises a first surface, and the second planar substrate comprises a second surface facing the first surface. The heater comprises a first heating element and a second heating element in parallel connection, and the first heating element is disposed on the first surface. The fusible element is disposed on the first surface and adjacent to the first and second heating elements, thereby the fusible element is melted by absorbing the heat generated by the first heating element and/or second heating element. The second heating element has a resistance at least twice that of the first heating element.

公开(公告)号：US20190122847A1

公开(公告)日：2019-04-25

申请号：US15924841

申请日：2018-03-19

申请人： Polytronics Technology Corp.

发明人： Tsungmin SU ,  Tongcheng Tsai ,  David Shau Chew WANG

IPC分类号： H01H85/46 ,  H05K1/02 ,  H01H37/76

摘要： A protection device comprises a first planar substrate, a second planar substrate, a heating element and a fusible element. The second planar substrate is attached to the underside of the first planar substrate to form a composite structure. The heating element comprises an insulating layer and a heating layer disposed thereon. The heating element is disposed on the first planar substrate, and the insulating layer is disposed between the first planar substrate and the heating layer. The fusible element is disposed above the heating element. The heating element heats up to blow the fusible element in the event of over-voltage or over-temperature.