-
公开(公告)号：US11990258B2
公开(公告)日：2024-05-21
申请号：US17954596
申请日：2022-09-28
发明人： Hsiu-Che Yen , Yung-Hsien Chang , Cheng-Yu Tung , Chen-Nan Liu , Chia-Yuan Lee , Yu-Chieh Fu , Yao-Te Chang , Fu-Hua Chu
CPC分类号： H01C7/027 , H01C1/1406 , H01C7/021 , H02H9/026
摘要： An over-current protection device includes first and second electrode layers and a PTC material layer laminated therebetween. The PTC material layer includes a polymer matrix, a conductive filler, and a titanium-containing dielectric filler. The polymer matrix has a fluoropolymer. The titanium-containing dielectric filler has a compound represented by a general formula of MTiO3, wherein the M represents transition metal or alkaline earth metal. The total volume of the PTC material layer is calculated as 100%, and the titanium-containing dielectric filler accounts to for 5-15% by volume of the PTC material layer.
-
公开(公告)号：US20240096524A1
公开(公告)日：2024-03-21
申请号：US18523992
申请日：2023-11-30
发明人： Kojiro TOKIEDA , Hideyuki SUZUKI , Koichi YAMADA , Miki SASAKI
CPC分类号： H01C1/1413 , H01C1/1406 , H01C1/142 , H01C7/021 , H01C7/041 , H01C7/10 , H01G4/2325 , H01G4/30
摘要： An electronic component includes a ceramic body, and an external electrode on the ceramic body, the external electrode includes a base layer continuously covering an end surface of the ceramic body and a portion of a side surface bordering the end surface, and a plating layer covering the base layer, the ceramic body includes a recess open on the side surface, an opening of the recess includes a pair of edges, one edge of the opening is located within a covered region on the side surface covered with the base layer, and the other edge of the opening is spaced away from the covered region.
-
公开(公告)号：US11721456B2
公开(公告)日：2023-08-08
申请号：US16808835
申请日：2020-03-04
CPC分类号： H01C7/021 , H01C1/08 , H05B3/06 , H05B3/141 , H05B3/24 , H01M2200/106 , H05B2203/02
摘要： A PTC heating element and an electric heating device containing such a PTC heating element are disclosed. The PTC heating element comprises two insulating layers with a metallic coating provided on one side and a PTC element arranged therebetween which is provided on oppositely disposed main side surfaces with a respective metallization which is electrically conductively connected to the coating of one of the insulating layers. The metallization provided on one of the main side surfaces is assigned only to one potential for energizing the PTC element. The metallization provided on the other main side surface is assigned to only the other potential for energizing the PTC element. The metallization of the one main side surface of the PTC element and the metallization of the other main side surface of the PTC element are formed in such a way that the current path (P) through the PTC element is extended relative to the thickness (D) of the PTC element.
-
公开(公告)号：US09972927B2
公开(公告)日：2018-05-15
申请号：US14832481
申请日：2015-08-21
IPC分类号： H01R13/71 , H01R12/70 , H01R13/713 , H01C7/02 , H01R13/11
CPC分类号： H01R12/7088 , H01C7/021 , H01R13/113 , H01R13/71 , H01R13/7137
摘要： An electrical power contact includes a mating segment having a mating interface at which the electrical power contact is configured to mate with a mating contact. The mating segment includes an electrically conductive base layer, and an electrically conductive outer layer that includes the mating interface. The mating segment also includes a circuit protection layer that extends between the base layer and the outer layer. The circuit protection layer provides an electrical pathway between the base layer and the outer layer. The circuit protection layer includes a selectively conductive material that is configured to open the electrical pathway between the base layer and the outer layer when an electrical current above a predetermined threshold is passed through the circuit protection layer.
-
公开(公告)号：US09959975B2
公开(公告)日：2018-05-01
申请号：US14805546
申请日：2015-07-22
CPC分类号： H01G4/30 , H01C7/021 , H01C7/041 , H01C7/1006 , H01C7/18 , H01G4/1209 , H01G4/224
摘要： A ceramic electronic component that includes a ceramic element, and a coating film and external electrodes on a surface of the ceramic element. The coating film includes cationic elements from a constituent element of the ceramic element, which are ionized and deposited from the ceramic element, and a resin. The surface of the coating film is recessed relative to a surface of wrapping parts of the external electrodes on the surface of the ceramic element.
-
公开(公告)号：US20180106687A1
公开(公告)日：2018-04-19
申请号：US15784695
申请日：2017-10-16
申请人： KOA Corporation
发明人： Ryusuke SUZUKI , Takumi ASHIKAWA , Katsuya MIURA
摘要： A temperature sensor element has such a structure as, when reinforcing lead wires on internal electrodes with a paste, one side surface of each of the lead wires is covered with a reinforcement paste and the other side surface is not covered with the reinforcement paste without covering the entire lead wires welded and connected to the internal electrodes. This allows elimination of cause of cracks generating, thereby securing sufficient joining strength and reinforcement of conductivity of the internal electrodes and the lead wires, and securing connection strength between the lead wires and the internal electrodes.
-
公开(公告)号：US09928947B1
公开(公告)日：2018-03-27
申请号：US15653656
申请日：2017-07-19
发明人： Wen-Hsi Lee
CPC分类号： H01C7/003 , H01C1/14 , H01C7/021 , H01C17/006 , H01C17/06526 , H01C17/281
摘要： A low-ohmic chip resistor with high conductivity is fabricated. The chip resistor has an electrode of a base metal or base-metal alloy. The base-metal or base-metal-alloy electrode and a resistor layer are fabricated through thick-film printing with sintering at a low temperature in the air. Therein, a thick-film paste made of a cheap low-reduction-potential metal (such as aluminum (Al) or nickel (Ni)) is formed through screen-printing and sintering. Then, the layer of the cheap low-reduction-potential metal is used as a sacrificial layer to be immersed in a metal solution having a high reduction potential. Therein, a wet chemical alternation reaction is processed for obtaining a metal electrode having the high reduction potential. Or, the sacrificial layer may be immersed in a mixed solution of several different metal having high reduction potential to process wet chemical alternation reaction for obtaining an alloy of metal mixed with different composition.
-
公开(公告)号：US09840787B2
公开(公告)日：2017-12-12
申请号：US14963298
申请日：2015-12-09
发明人： Eriko Kitada , Hiromasa Ito , Tsutomu Sasaki
CPC分类号： C25D5/54 , C25D5/12 , C25D7/00 , H01C1/14 , H01C1/1406 , H01C1/1413 , H01C7/008 , H01C7/021 , H01C7/041 , H01C7/042
摘要： A ceramic electronic component includes a ceramic body, baked external electrodes, and plated external electrodes, and glass layers derived from a glass material included in a conductive paste of the baked external electrodes, are provided at interfaces between the baked external electrodes and the ceramic body, such that the glass layers extend from the interfaces between the ceramic body and the baked external electrodes to a surface of the ceramic body that does not contain the baked external electrodes.
-
公开(公告)号：US09823136B2
公开(公告)日：2017-11-21
申请号：US14534419
申请日：2014-11-06
发明人： Katherine O'Sullivan , Anthony Herlihy , Anthony Maher , Balasubramaniam Vaidhyanathan , Yang Chen
摘要： A temperature sensor includes a substrate, a platinum resistor arranged on at least one surface of the substrate, a protective layer covering at least a portion of the platinum resistor and a cover layer covering at least a portion of the protective layer, the cover layer including Al2O3, SiO2 and Y2O3. The cover layer may also include B2O3. A conductive wire may be electrically connected to the platinum resistor. A glass ceramic may be covering at least a portion of the conductive wire, platinum resistor, protective layer and cover layer.
-
公开(公告)号：US09697934B2
公开(公告)日：2017-07-04
申请号：US15382368
申请日：2016-12-16
申请人： BOURNS, INC.
发明人： Gordon L. Bourns , Stelar Chu , Daniel E. Grindell , David Huang , John Kelly , Erik Meijer
CPC分类号： H01C7/021 , H01C1/016 , H01C1/1406 , H01C1/1413 , H01C7/005 , H01C7/028 , H01C7/041 , H01C7/049 , H01C7/18 , H01C17/02 , H01C17/281 , Y10T29/49165
摘要： Surface-mountable conductive polymer devices include a conductive polymer layer between first and second electrodes, on which are disposed first and second insulation layers, respectively. First and second planar conductive terminals are on the second insulation layer. A first cross-conductor connects the second electrode to the first terminal, and is separated from the first electrode by a portion of the first insulation layer. A second cross-conductor connects the first electrode to the second terminal, and is separated from the second electrode by a portion of the second insulation layer. In some embodiments, at least one cross-conductor includes a beveled portion through the first insulation layer to provide enhanced adhesion between the cross-conductor and the first insulation layer, while allowing greater thermal expansion without undue stress. In other embodiments, these advantages are achieved by having at least one cross-conductor in physical contact with a metallized anchor pad on the first insulation layer.
-
-
-
-
-
-
-
-
-
搜索结果
295 条记录 (耗时 0.023 秒)
