公开(公告)号：US11892693B1

公开(公告)日：2024-02-06

申请号：US17951916

申请日：2022-09-23

Applicant: Psiquantum, Corp.

Inventor： Gabriel J. Mendoza ,  Matteo Staffaroni ,  Albert Wang ,  John Eugene Berg ,  Ramakanth Alapati

IPC: G02B6/43 ,  H01L25/065 ,  G02B6/12 ,  H01L23/00 ,  G06N10/00

CPC classification number: G02B6/43 ,  G02B6/12002 ,  G06N10/00 ,  H01L24/47 ,  H01L25/0657 ,  G02B2006/12061

Abstract: A device includes a die stack including a first die including a quantum circuit and a second die including an electronic circuit. The second die and the first die face each other. The device also includes a first interconnect between the quantum circuit and the electronic circuit and a second interconnect between the quantum circuit and the electronic circuit.

公开(公告)号：US12242123B1

公开(公告)日：2025-03-04

申请号：US18392124

申请日：2023-12-21

Applicant: Psiquantum, Corp.

Inventor： Gabriel J. Mendoza ,  Matteo Staffaroni ,  Albert Wang ,  John Eugene Berg ,  Ramakanth Alapati

IPC: G02B6/43 ,  G02B6/12 ,  G06N10/00 ,  H01L23/00 ,  H01L25/065

Abstract: A device includes a die stack including a first die including a quantum circuit and a second die including an electronic circuit. The second die and the first die face each other. A coupler is bonded to a first surface of the first die, an optical fiber is coupled to the coupler for coupling light from the optical fiber to the quantum circuit.

公开(公告)号：US20230123000A1

公开(公告)日：2023-04-20

申请号：US18082520

申请日：2022-12-15

Applicant: Psiquantum, Corp.

Inventor： Vimal Kumar Kamineni ,  Matteo Staffaroni ,  Faraz Najafi ,  Ann Melnichuk ,  George Kovall ,  Yong Liang

IPC: G02B6/136 ,  G02B6/132 ,  G02B6/122

Abstract: A device includes a substrate, a dielectric layer on the substrate, a waveguide within the dielectric layer, and a photodetector optically coupled to the waveguide. The photodetector is disposed above the waveguide layer and is monolithically integrated with the substrate. The photodetector is configured to operate at low temperatures, such as below about 50 K or about 20 K. In some embodiments, the monolithic photonic device includes thermal isolation structures and optical isolation structures. Techniques for manufacturing the monolithic photonic device, including the thermal isolation structures and optical isolation structures, are also described.

公开(公告)号：US11550108B1

公开(公告)日：2023-01-10

申请号：US17378533

申请日：2021-07-16

Applicant: Psiquantum, Corp.

Inventor： Gabriel J. Mendoza ,  Matteo Staffaroni ,  Albert Wang ,  John Eugene Berg ,  Ramakanth Alapati

IPC: G02B6/43 ,  H01L25/065 ,  G02B6/12 ,  H01L23/00 ,  G06N10/00

Abstract: Techniques disclosed herein relate to devices that each include one or more photonic integrated circuits and/or one or more electronic integrated circuits. In one embodiment, a device includes a silicon substrate, a die stack bonded (e.g., fusion-bonded) on the silicon substrate, and a printed circuit board (PCB) bonded on the silicon substrate, where the PCB is electrically coupled to the die stack. The die stack includes a photonic integrated circuit (PIC) that includes a photonic integrated circuit, and an electronic integrated circuit (EIC) die that includes an electronic integrated circuit, where the EIC die and the PIC die are bonded face-to-face (e.g., by fusion bonding or hybrid bonding) such that the photonic integrated circuit and the electronic integrated circuit face each other. In some embodiments, the device also includes a plurality of optical fibers coupled to the photonic integrated circuit.

公开(公告)号：US11493713B1

公开(公告)日：2022-11-08

申请号：US16576626

申请日：2019-09-19

Applicant: Psiquantum, Corp.

Inventor： Gabriel J. Mendoza ,  Matteo Staffaroni ,  Albert Wang ,  John Eugene Berg ,  Ramakanth Alapati

IPC: G02B6/43 ,  H01L25/065 ,  G02B6/12 ,  G06N10/00 ,  H01L23/00

Abstract: Techniques disclosed herein relate to devices that each include one or more photonic integrated circuits and/or one or more electronic integrated circuits. In one embodiment, a device includes a silicon substrate, a die stack bonded (e.g., fusion-bonded) on the silicon substrate, and a printed circuit board (PCB) bonded on the silicon substrate, where the PCB is electrically coupled to the die stack. The die stack includes a photonic integrated circuit (PIC) that includes a photonic integrated circuit, and an electronic integrated circuit (EIC) die that includes an electronic integrated circuit, where the EIC die and the PIC die are bonded face-to-face (e.g., by fusion bonding or hybrid bonding) such that the photonic integrated circuit and the electronic integrated circuit face each other. In some embodiments, the device also includes a plurality of optical fibers coupled to the photonic integrated circuit.

公开(公告)号：US11493714B1

公开(公告)日：2022-11-08

申请号：US17157918

申请日：2021-01-25

Applicant: Psiquantum, Corp.

Inventor： Gabriel J. Mendoza ,  Matteo Staffaroni ,  Albert Wang ,  John Eugene Berg ,  Ramakanth Alapati

IPC: G02B6/43 ,  H01L25/065 ,  G02B6/12 ,  H01L23/00 ,  G06N10/00

Abstract: Techniques disclosed herein relate to devices that each include one or more photonic integrated circuits and/or one or more electronic integrated circuits. In one embodiment, a device includes a silicon substrate, a die stack bonded (e.g., fusion-bonded) on the silicon substrate, and a printed circuit board (PCB) bonded on the silicon substrate, where the PCB is electrically coupled to the die stack. The die stack includes a photonic integrated circuit (PIC) that includes a photonic integrated circuit, and an electronic integrated circuit (EIC) die that includes an electronic integrated circuit, where the EIC die and the PIC die are bonded face-to-face (e.g., by fusion bonding or hybrid bonding) such that the photonic integrated circuit and the electronic integrated circuit face each other. In some embodiments, the device also includes a plurality of optical fibers coupled to the photonic integrated circuit.