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    Quantum computing die assembly with thru-silicon vias and connected logic circuit
    2.
    发明授权
    Quantum computing die assembly with thru-silicon vias and connected logic circuit 有权

    公开(公告)号：US11493714B1

    公开(公告)日：2022-11-08

    申请号：US17157918

    申请日：2021-01-25

    Applicant: Psiquantum, Corp.

    Inventor： Gabriel J. Mendoza ,  Matteo Staffaroni ,  Albert Wang ,  John Eugene Berg ,  Ramakanth Alapati

    IPC: G02B6/43 ,  H01L25/065 ,  G02B6/12 ,  H01L23/00 ,  G06N10/00

    Abstract: Techniques disclosed herein relate to devices that each include one or more photonic integrated circuits and/or one or more electronic integrated circuits. In one embodiment, a device includes a silicon substrate, a die stack bonded (e.g., fusion-bonded) on the silicon substrate, and a printed circuit board (PCB) bonded on the silicon substrate, where the PCB is electrically coupled to the die stack. The die stack includes a photonic integrated circuit (PIC) that includes a photonic integrated circuit, and an electronic integrated circuit (EIC) die that includes an electronic integrated circuit, where the EIC die and the PIC die are bonded face-to-face (e.g., by fusion bonding or hybrid bonding) such that the photonic integrated circuit and the electronic integrated circuit face each other. In some embodiments, the device also includes a plurality of optical fibers coupled to the photonic integrated circuit.

    Active alignment of optical die to optical substrates
    3.
    发明授权
    Active alignment of optical die to optical substrates 有权

    公开(公告)号：US11035752B1

    公开(公告)日：2021-06-15

    申请号：US16786830

    申请日：2020-02-10

    Applicant: Psiquantum, Corp.

    Inventor： Bradley Snyder ,  Ramakanth Alapati ,  Gabriel J. Mendoza ,  Soumyadipta Basu

    IPC: G01M11/02

    Abstract: An assembly system for assembling an optical die to an optical substrate includes test equipment configured to test optical couplers formed between the optical die and the optical substrate. The assembly system is configured to adjust an alignment of the optical die relative to the optical substrate until the optical couplers meet a performance metric. After the performance metric is met the optical die is permanently attached to the optical substrate.

    Hybrid system including photonic and electronic integrated circuits and cooling plate
    5.
    发明授权
    Hybrid system including photonic and electronic integrated circuits and cooling plate 有权

    公开(公告)号：US11107799B1

    公开(公告)日：2021-08-31

    申请号：US16724135

    申请日：2019-12-20

    Applicant: Psiquantum, Corp.

    Inventor： Ramakanth Alapati ,  Gabriel J. Mendoza

    IPC: H01L31/0232 ,  H01L25/16 ,  H01L23/00 ,  H01L23/367 ,  H01L23/498 ,  H01L23/48 ,  H01L21/48 ,  G02B6/36

    Abstract: Techniques disclosed herein relate generally to integrating photonic integrated circuits and electronic integrated circuits in a same package. A device includes a semiconductor substrate and a die stack on the semiconductor substrate. The die stack includes a photonic integrated circuit (PIC) die and an electronic integrated circuit (EIC) die. The PIC die includes a PIC substrate and a photonic integrated circuit formed on the PIC substrate. The EIC die includes an EIC substrate and an electronic integrated circuit formed on the EIC substrate. The EIC die and the PIC die are bonded such that the PIC substrate and the EIC substrate are disposed on opposing sides of the die stack. The PIC substrate is bonded to the semiconductor substrate. The device also includes a cooling plate bonded to the EIC substrate.

    ACTIVE ALIGNMENT OF OPTICAL DIE TO OPTICAL SUBSTRATES
    6.
    发明申请
    ACTIVE ALIGNMENT OF OPTICAL DIE TO OPTICAL SUBSTRATES 有权

    公开(公告)号：US20250093230A1

    公开(公告)日：2025-03-20

    申请号：US18902420

    申请日：2024-09-30

    Applicant: Psiquantum, Corp.

    Inventor： Bradley Snyder ,  Ramakanth Alapati ,  Gabriel J. Mendoza ,  Soumyadipta Basu

    IPC: G01M11/02

    Abstract: A tool for an assembly machine comprising a gantry mechanism is disclosed. The tool includes a connector for connecting the tool to the gantry mechanism; a first surface for temporarily interfacing the tool to an optical die; a retention apparatus configured to temporarily couple the optical die to the first surface; and a first tool optical coupler positioned at the first surface and configured to form a first optical connection to the optical die when the optical die is positioned at the first surface.

    Quantum computing die assembly with thru-silicon vias
    10.
    发明授权
    Quantum computing die assembly with thru-silicon vias 有权

    公开(公告)号：US11550108B1

    公开(公告)日：2023-01-10

    申请号：US17378533

    申请日：2021-07-16

    Applicant: Psiquantum, Corp.

    Inventor： Gabriel J. Mendoza ,  Matteo Staffaroni ,  Albert Wang ,  John Eugene Berg ,  Ramakanth Alapati

    IPC: G02B6/43 ,  H01L25/065 ,  G02B6/12 ,  H01L23/00 ,  G06N10/00

    Abstract: Techniques disclosed herein relate to devices that each include one or more photonic integrated circuits and/or one or more electronic integrated circuits. In one embodiment, a device includes a silicon substrate, a die stack bonded (e.g., fusion-bonded) on the silicon substrate, and a printed circuit board (PCB) bonded on the silicon substrate, where the PCB is electrically coupled to the die stack. The die stack includes a photonic integrated circuit (PIC) that includes a photonic integrated circuit, and an electronic integrated circuit (EIC) die that includes an electronic integrated circuit, where the EIC die and the PIC die are bonded face-to-face (e.g., by fusion bonding or hybrid bonding) such that the photonic integrated circuit and the electronic integrated circuit face each other. In some embodiments, the device also includes a plurality of optical fibers coupled to the photonic integrated circuit.

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