公开(公告)号：US20140196833A1

公开(公告)日：2014-07-17

申请号：US14115886

申请日：2012-05-04

Applicant: Purdue Research Foundation

Inventor： Pipes R. Byron ,  Ian Cameron Coker ,  Douglas Edward Adams ,  Ronald Sterkenburg ,  Jeffrey P. Youngblood

IPC: B29C73/10 ,  B29C73/02

CPC classification number: B29C73/02 ,  B29C35/02 ,  B29C70/443 ,  B29C73/10 ,  B29C73/12 ,  B29C73/34 ,  B29C2073/262

Abstract: The present disclosure provides a method of repairing a damaged portion of a panel formed of composite material. The method includes preparing the damaged portion for repair and applying a pressure responsive adhesive layer to substantially cover the damaged portion. The method also includes disposing a vacuum-assisted resin transfer molding repair patch assembly to substantially cover the damaged portion and substantially covering the repair patch assembly with a vacuum bag assembly. Resin is introduced into and impregnates the repair patch assembly. The repair patch assembly is cured after being impregnated.

Abstract translation: 本公开提供了修复由复合材料形成的面板的损坏部分的方法。 该方法包括制备用于修理的损坏部分并施加压敏粘合剂层以基本上覆盖受损部分。 该方法还包括设置真空辅助树脂传递模塑修复贴片组件以基本上覆盖受损部分并且用真空袋组件基本上覆盖修补贴片组件。 将树脂引入并浸渍修补贴片组件。 修补补丁组件在浸渍后固化。