公开(公告)号：US12300337B2

公开(公告)日：2025-05-13

申请号：US17944691

申请日：2022-09-14

Applicant: QUALCOMM INCORPORATED

Inventor： Hong Dai ,  Amir Borovietzky ,  Arvind Jain ,  Massine Bitam ,  Madan Krishnappa

IPC: G11C29/32 ,  G01R31/319 ,  G11C29/44

Abstract: A system for repairing a random access memory may include serial test interface logic, fuse-sense logic, a repair data register chain, and multiplexing logic. The repair data register chain may include serially interconnected data registers configured to shift data through the repair data register chain. Each data register of the repair data register chain may have a data output configured to be coupled to a repair information input of the random access memory. The multiplexing logic may be configured to provide a soft-repair mode and a hard-repair mode. When the soft-repair mode is selected, the multiplexing logic may be configured to receive soft-repair data provided by the serial test interface logic into the data registers. When the hard-repair mode is selected, the multiplexing logic may be configured to receive the data provided by the fuse-sense logic into the data registers.