公开(公告)号：US20130285687A1

公开(公告)日：2013-10-31

申请号：US13793880

申请日：2013-03-11

Applicant: QUALCOMM INCORPORATED

Inventor： Tapan J. Chakraborty ,  Rajamani Sethuram ,  Riko Radojcic

IPC: G01R31/28

CPC classification number: G01R31/2874 ,  G01R31/2856 ,  G01R31/2875

Abstract: Apparatus and methods are described herein for emulating the hot spot distribution of a functional test by applying vectors for structural test to an integrated circuit (IC). The affects of the hot spots can then be tested and characterized. The vectors may be generated on the IC, or may be fed to the IC via an external source.

Abstract translation: 本文描述了用于通过将结构测试的向量应用于集成电路（IC）来模拟功能测试的热点分布的装置和方法。 然后可以测试和表征热点的影响。 矢量可以在IC上产生，或者可以经由外部源馈送到IC。