公开(公告)号：US20150043156A1

公开(公告)日：2015-02-12

申请号：US13963248

申请日：2013-08-09

Applicant: QUALCOMM INCORPORATED

Inventor： Ankur JAIN ,  Unni VADAKKANMARUVEEDU ,  Vinay MITTER

IPC: G06F1/20

CPC classification number: G06F1/206 ,  G06F2200/1633 ,  H04M1/72575

Abstract: The various embodiments provide methods and systems for adjusting the thermal mitigation system of a mobile electronic device when an add-on outer casing is attached. The mobile electronic device determine whether an add-on outer case is attached to the mobile electronic device and change a thermal mitigation parameter of a thermal mitigation process implemented on the mobile electronic device in response. The determination may be via a sensor or a user input. A changed thermal mitigation parameter may be stored in memory, or input by a user or in a communication from the add-on case. The changed thermal mitigation parameter may be determined based on a particular make, model or properties of the add-on case, and/or may be obtained from a database stored in the device or accessed via a network. Removal of the case may be detected and the thermal mitigation parameter returned to an initial value.

Abstract translation: 各种实施例提供了当附加外壳时调整移动电子设备的热缓解系统的方法和系统。 移动电子设备确定附加外壳是否附接到移动电子设备，并且响应地改变在移动电子设备上实现的热缓解过程的热缓解参数。 该确定可以通过传感器或用户输入。 改变的热缓解参数可以存储在存储器中，或者由用户输入或来自附加箱的通信。 改变的热缓解参数可以基于附加情况的特定品牌，型号或属性来确定，和/或可以从存储在设备中的数据库中获得或经由网络访问。 可以检测到情况的移除并且热缓解参数返回到初始值。