公开(公告)号：US20200091094A1

公开(公告)日：2020-03-19

申请号：US16132323

申请日：2018-09-14

Applicant: QUALCOMM Incorporated

Inventor： Changhan Hobie YUN ,  Mario Francisco VELEZ ,  Nosun PARK ,  Niranjan Sunil MUDAKATTE ,  Wei-Chuan CHEN ,  Paragkumar Ajaybhai THADESAR ,  Christopher POLLOCK ,  Xiaoju YU ,  Rongguo ZHOU ,  Kai LIU ,  Jonghae KIM

IPC: H01L23/64 ,  H01L23/31 ,  H01L23/15 ,  H03H9/54 ,  H03H9/64 ,  H03H7/01 ,  H03H3/02 ,  H03H3/08

Abstract: A filter including an insulating die having a plurality of MIM (Metal Insulator Metal) capacitors disposed within the die is disclosed. A 2.5D (2.5 Dimensional) inductor disposed within a redistribution layer (RDL) is electrically coupled to at least one of the plurality of MIM capacitors in the die. A 3D (3 Dimensional) inductor is disposed around the die and is electrically coupled to at least one of the plurality of MIM capacitors.