公开(公告)号：US10132861B2

公开(公告)日：2018-11-20

申请号：US15268463

申请日：2016-09-16

Applicant: QUALCOMM Incorporated

Inventor： Rama Rao Goruganthu ,  Gaurav Sunil Mattey ,  Martin Villafana

IPC: G01R31/308 ,  G01R31/311 ,  G01R1/07 ,  G01R31/28

Abstract: A transparent coversheet intervenes between a lens and a thinned die in a visible light fault analysis tool so that the thinned die is robust to fractures. In addition, the transparent coversheet has a greater thermal mass than the thinned die and thus acts as a heat sink to prevent active circuitry in the thinned die from overheating during the visible light fault analysis.

公开(公告)号：US20180080983A1

公开(公告)日：2018-03-22

申请号：US15268463

申请日：2016-09-16

Applicant: QUALCOMM Incorporated

Inventor： Rama Rao Goruganthu ,  Gaurav Sunil Mattey ,  Martin Villafana

IPC: G01R31/311 ,  G01R31/28 ,  G01R1/07

CPC classification number: G01R31/311 ,  G01R1/071 ,  G01R31/2834

Abstract: A transparent coversheet intervenes between a lens and a thinned die in a visible light fault analysis tool so that the thinned die is robust to fractures. In addition, the transparent coversheet has a greater thermal mass than the thinned die and thus acts as a heat sink to prevent active circuitry in the thinned die from overheating during the visible light fault analysis.