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公开(公告)号:US20220061058A1
公开(公告)日:2022-02-24
申请号:US17404969
申请日:2021-08-17
Applicant: QUALCOMM Incorporated
Inventor: Haim WEISSMAN , Lior UZIEL
Abstract: A method of wireless communication of a wireless device in a C-V2X connection may include: determining a first WBEE of a symbol at a first bandwidth, the symbol being associated with no expected C-V2X transmissions, determining a second WBEE of the symbol at a second bandwidth, and identifying an interference based on the first WBEE and the second WBEE. The method may also include notifying an operator of the wireless device about the identified interference.
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公开(公告)号:US20240106562A1
公开(公告)日:2024-03-28
申请号:US17935044
申请日:2022-09-23
Applicant: QUALCOMM Incorporated
Inventor: Haim WEISSMAN , Rakesh JALOTA , Ryan Scott Castro SPRING , Francesco GATTA , Mehmet UZUNKOL
CPC classification number: H04K3/226 , H04B1/1027 , H04W4/40
Abstract: Methods and apparatus for performing automatic gain control (AGC) in bypass and filter modes for radio frequency (RF) front-end circuitry are described. An example method includes operating a receiver in a first mode during a first set of symbols of a first subframe. The method also includes, during a first symbol of the first subframe outside the first set of symbols, determining whether to operate the receiver in the first mode or a second mode in a second subframe, based at least in part on an output of a jamming detection circuit of the receiver in the first symbol. The method also includes controlling the receiver to operate in the first mode or the second mode in the second subframe, in accordance with the determination.
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公开(公告)号:US20240106115A1
公开(公告)日:2024-03-28
申请号:US17950367
申请日:2022-09-22
Applicant: QUALCOMM Incorporated
Inventor: Haim WEISSMAN , Idan Michael HORN , Elimelech GANCHROW
CPC classification number: H01Q3/36 , H01Q9/0407 , H05K1/0243 , H05K1/115 , H05K2201/10098
Abstract: Techniques are provided for reducing the form factor and insertion losses of beamforming networks. An example beamforming network configured to feed a phased array of antenna elements includes a first group of microstrip elements on a first layer of a printed circuit board, a second group of microstrip elements on a second layer of the printed circuit board, a metal layer disposed between the first layer and the second layer, and a plurality of vias configured to couple one or more elements in the first group of microstrip elements with one or more elements in the second group of microstrip elements.
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