公开(公告)号：US20200066630A1

公开(公告)日：2020-02-27

申请号：US16106679

申请日：2018-08-21

Applicant: QUALCOMM Incorporated

Inventor： Junjing Bao ,  Jie Deng ,  John Zhu ,  Giridhar Nallapati

IPC: H01L23/522 ,  H01L23/528 ,  H01L21/311 ,  H01L21/768 ,  H01L21/02 ,  H01L21/8234

Abstract: A semiconductor device includes a contact via and a metal interconnect on the contact via. The metal interconnect has a portion extending in a lengthwise direction that is wrapped around and in contact with a sidewall of the contact via. Along a widthwise direction, the metal interconnect does not contact the sidewall of the contact via.