公开(公告)号：US12204113B1

公开(公告)日：2025-01-21

申请号：US18465792

申请日：2023-09-12

Applicant: QUALCOMM Incorporated

Inventor： Jorge Luis Rosales ,  Le Gao ,  Peng Wang ,  Kenneth Baar

IPC: G02B27/01 ,  G02C11/00 ,  G06F1/16 ,  G06F1/20

Abstract: Head-mounted electronic device incorporating a piezo-electric device for dissipation of heat, and related methods of controlling the piezo-electric device to dissipate heat from the head-mounted electronic device are disclosed. To dissipate heat in the head-mounted electronic device, the piezo-electric device is integrated in the head-mounted electronic device and is fluidly coupled to an internal air chamber in the head-mounted electronic device that in fluid communication with an integrated circuit (IC). The piezo-electric device draws the heated air around the IC into the internal chamber that heats air inside the internal chamber. The piezo-electric device is configured to pump heated air in the internal chamber through an outlet to dissipate the heated air from the internal chamber. Dissipation of heated air heated from heat generated from the IC can keep the IC from exceeding its thermal limits and/or prevent the head-mounted electronic device from exceeding its skin temperature limit.