公开(公告)号：US10746474B2

公开(公告)日：2020-08-18

申请号：US16398001

申请日：2019-04-29

Applicant: QUALCOMM Incorporated

Inventor： Jorge Luis Rosales ,  Le Gao ,  Don Le ,  Jon James Anderson

IPC: F28D15/02 ,  H05K7/20 ,  F04B49/06 ,  F04B17/00 ,  H01L23/427

Abstract: A device that includes a region comprising an integrated device, and a heat dissipating device coupled to the region comprising the integrated device. The heat dissipating device is configured to dissipate heat away from the region. The heat dissipating device includes a fluid, an evaporator configured to evaporate the fluid, a condenser configured to condense the fluid, an inner wall coupled to the evaporator and the condenser, an outer shell encapsulating the fluid, the evaporator, the condenser and the inner wall, an evaporation portion configured to channel an evaporated fluid from the evaporator to the condenser, and a collection portion configured to channel a condensed fluid from the condenser to the evaporator. The heat dissipating device includes one or more piezo structures configured to move fluid inside the heat dissipating device.

公开(公告)号：US11437328B2

公开(公告)日：2022-09-06

申请号：US16874542

申请日：2020-05-14

Applicant: QUALCOMM Incorporated

Inventor： Peng Wang ,  Le Gao ,  Jorge Luis Rosales ,  Don Le

IPC: H01L23/552 ,  H01L23/427 ,  H01L25/065 ,  H01L21/48 ,  H01L23/00

Abstract: Aspects of the disclosure relate to thermal management of devices, such as mobile devices configured for wireless communication in wireless communication networks. A device includes a plurality of electronic components. An electromagnetic interference (EMI) shield is disposed on the electronic components, and a plurality of EMI gaskets are disposed between the electronic components. Each of the EMI gaskets surrounds a respective one of the plurality of electronic components. An evaporative cooler device embedded within the EMI shield is configured to transfer heat away from at least a portion of the electronic components.

公开(公告)号：US12204113B1

公开(公告)日：2025-01-21

申请号：US18465792

申请日：2023-09-12

Applicant: QUALCOMM Incorporated

Inventor： Jorge Luis Rosales ,  Le Gao ,  Peng Wang ,  Kenneth Baar

IPC: G02B27/01 ,  G02C11/00 ,  G06F1/16 ,  G06F1/20

Abstract: Head-mounted electronic device incorporating a piezo-electric device for dissipation of heat, and related methods of controlling the piezo-electric device to dissipate heat from the head-mounted electronic device are disclosed. To dissipate heat in the head-mounted electronic device, the piezo-electric device is integrated in the head-mounted electronic device and is fluidly coupled to an internal air chamber in the head-mounted electronic device that in fluid communication with an integrated circuit (IC). The piezo-electric device draws the heated air around the IC into the internal chamber that heats air inside the internal chamber. The piezo-electric device is configured to pump heated air in the internal chamber through an outlet to dissipate the heated air from the internal chamber. Dissipation of heated air heated from heat generated from the IC can keep the IC from exceeding its thermal limits and/or prevent the head-mounted electronic device from exceeding its skin temperature limit.