公开(公告)号：US09324397B1

公开(公告)日：2016-04-26

申请号：US14598528

申请日：2015-01-16

Applicant: QUALCOMM Incorporated

Inventor： Kunal Mukesh Desai ,  Piyush Gupta ,  Bernie Jord Yang ,  Umesh Madhusudan Rao

IPC: G11C7/00 ,  G11C7/22 ,  G11C7/10 ,  G11C8/06 ,  G11C8/18

CPC classification number: G11C7/22 ,  G06F13/1694 ,  G11C7/10 ,  G11C8/06 ,  G11C8/18 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15311 ,  H01L2924/00014

Abstract: A configurable die including a logic element configured to communicate a control and address (CA) signal and a data (DQ) signal, and a first generic physical interface (PHY) and a second generic PHY in communication with the logic element, wherein each of the first generic PHY and the second generic PHY is configurable as a CA PHY and as a DQ PHY, and wherein the logic element is configurable to communicate the CA signal and the DQ signal to different ones of the first and second generic PHYs.

Abstract translation: 一种可配置管芯，包括被配置为传送控制和地址（CA）信号和数据（DQ））信号的逻辑元件，以及与逻辑元件通信的第一通用物理接口（PHY）和第二通用PHY，其中每个 第一通用PHY和第二通用PHY可配置为CA PHY和DQ PHY，并且其中逻辑元件可配置为将CA信号和DQ信号传送到第一和第二通用PHY中的不同PHY。