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公开(公告)号:US20170338255A1
公开(公告)日:2017-11-23
申请号:US15161152
申请日:2016-05-20
发明人: Changhan Hobie YUN , Daeik Daniel KIM , Jonghae KIM , Mario Mario VELEZ , Chengjie ZUO , David Francis BERDY
CPC分类号: H01L27/13 , H01L21/84 , H01L23/49822 , H01L28/10 , H01L28/40 , H03H7/0115 , H03H2001/0085
摘要: The present disclosure provides integrated circuit apparatuses and methods for manufacturing integrated circuit apparatuses. An integrated circuit apparatus may include a first insulator, the first insulator being substantially planar and having a first top surface and a first bottom surface opposite the first top surface, a first conductor disposed on the first insulator, a second insulator, the second insulator being substantially planar and having a second top surface and a second bottom surface opposite the second top surface, a second conductor disposed on the second insulator, and a dielectric layer disposed between the first bottom conductor of the first insulator and the second top conductor of the second insulator.