公开(公告)号：US20170345546A1

公开(公告)日：2017-11-30

申请号：US15192679

申请日：2016-06-24

Applicant: QUALCOMM Incorporated

Inventor： Miena Armanious

IPC: H01F27/28 ,  H03H7/01 ,  H03F15/00 ,  H03H7/38 ,  H03B15/00

CPC classification number: H01F27/2804 ,  H01F17/0006 ,  H01F2017/0073 ,  H03B15/00 ,  H03F15/00 ,  H03H7/0138 ,  H03H7/38

Abstract: Exemplary embodiments of the disclosure are related to inductors, e.g., at least a pair of planar inductors, for wireless communication apparatus, for example transceivers used in a wireless device. A device may include a first planar inductor configured on a first area of a substrate. The first planar inductor includes a first loop configured to produce a first magnetic field in a first direction and a second loop configured to produce a second magnetic field in a second direction. The device further includes a second planar inductor configured on a second area of the substrate. The second planar inductor includes a third loop configured to produce a third magnetic field in a third direction and a fourth loop configured to produce a fourth magnetic field in a fourth direction. The second area may at least partially overlap the first area.

公开(公告)号：US20180323765A1

公开(公告)日：2018-11-08

申请号：US15585810

申请日：2017-05-03

Applicant: QUALCOMM Incorporated

Inventor： Miena Armanious ,  Lan Nan ,  Mina Iskander

IPC: H03H7/01 ,  H03H1/00 ,  H03H3/00

CPC classification number: H03H7/0115 ,  H01F2017/0026 ,  H01P1/2007 ,  H01P1/20381 ,  H01P7/08 ,  H03H1/00 ,  H03H3/00 ,  H03H7/1741 ,  H03H2001/0021 ,  H03H2001/0085

Abstract: Aspects of the disclosure are directed to an inductor-capacitor (LC) resonator. In accordance with one aspect, the LC resonator architecture includes a lower metal plate, the lower metal plate is of an open configuration; an upper metal plate, the upper metal plate is stacked vertically above the lower metal plate and is vertically aligned to the lower metal plate; a first ultra thick metal (UTM) plate, the first UTM plate is stacked vertically above the upper metal plate and is vertically aligned to both the upper metal plate and the lower metal plate; and an electrical coupling to couple the first UTM plate to the upper metal plate, wherein a current on the first UTM plate flows through to the upper metal plate through the electrical coupling, the current flows in a direction on the first UTM plate and in the same direction on the upper metal plate.

公开(公告)号：US20170345547A1

公开(公告)日：2017-11-30

申请号：US15192752

申请日：2016-06-24

Applicant: QUALCOMM Incorporated

Inventor： Miena Armanious

IPC: H01F27/28 ,  H03H7/01 ,  H03F15/00

CPC classification number: H01F27/2804 ,  H01F17/0013 ,  H01F27/346 ,  H01F2017/0073 ,  H01F2027/2809 ,  H03F15/00 ,  H03H7/0138

Abstract: Exemplary embodiments of the disclosure are related to inductors, e.g., at least a pair of planar inductors for a wireless apparatus, for example transceivers used in a wireless device. A device may include a first planar inductor configured on a first area of a substrate. The first planar inductor includes a first loop configured to produce a first magnetic field in a first direction and a second loop configured to produce a second magnetic field in a second direction. The device further includes a second planar inductor configured on a second area of the substrate. The second planar inductor includes a third loop configured to produce a third magnetic field in a third direction. The third loop may be configured to surround the first loop and divide the second loop into an enclosed area and an external area.