公开(公告)号：US20150130552A1

公开(公告)日：2015-05-14

申请号：US14076298

申请日：2013-11-11

Applicant: QUALCOMM Incorporated

Inventor： Maulin Pareshbhai Bhagat ,  Thomas Andrew Myers ,  Lan Nan ,  Zhang Jin

IPC: H04B3/28

CPC classification number: H04B5/0075 ,  H01F38/14 ,  H01L23/5223 ,  H01L23/5227 ,  H01L23/645 ,  H01L23/66 ,  H01L27/101 ,  H01L28/10 ,  H01L2223/6661 ,  H01L2223/6688 ,  H01L2924/0002 ,  H03H7/0115 ,  H01L2924/00

Abstract: A tunable guard ring for improved circuit isolation is disclosed. In an exemplary embodiment, an apparatus includes a closed loop guard ring formed on an integrated circuit and magnetically coupled by a selected coupling factor to a first inductor formed on the integrated circuit. The apparatus also includes a tunable capacitor forming a portion of the closed loop guard ring and configured to reduce magnetic field coupling from the first inductor to a second inductor.

Abstract translation: 公开了一种用于改善电路隔离的可调保护环。 在一个示例性实施例中，一种装置包括形成在集成电路上的闭环保护环，并通过选定的耦合因素磁耦合到​​形成在集成电路上的第一电感器。 该装置还包括形成闭环保护环的一部分的可调电容器，并且被配置为减小从第一电感器到第二电感器的磁场耦合。

公开(公告)号：US20180323765A1

公开(公告)日：2018-11-08

申请号：US15585810

申请日：2017-05-03

Applicant: QUALCOMM Incorporated

Inventor： Miena Armanious ,  Lan Nan ,  Mina Iskander

IPC: H03H7/01 ,  H03H1/00 ,  H03H3/00

CPC classification number: H03H7/0115 ,  H01F2017/0026 ,  H01P1/2007 ,  H01P1/20381 ,  H01P7/08 ,  H03H1/00 ,  H03H3/00 ,  H03H7/1741 ,  H03H2001/0021 ,  H03H2001/0085

Abstract: Aspects of the disclosure are directed to an inductor-capacitor (LC) resonator. In accordance with one aspect, the LC resonator architecture includes a lower metal plate, the lower metal plate is of an open configuration; an upper metal plate, the upper metal plate is stacked vertically above the lower metal plate and is vertically aligned to the lower metal plate; a first ultra thick metal (UTM) plate, the first UTM plate is stacked vertically above the upper metal plate and is vertically aligned to both the upper metal plate and the lower metal plate; and an electrical coupling to couple the first UTM plate to the upper metal plate, wherein a current on the first UTM plate flows through to the upper metal plate through the electrical coupling, the current flows in a direction on the first UTM plate and in the same direction on the upper metal plate.

公开(公告)号：US09312927B2

公开(公告)日：2016-04-12

申请号：US14076298

申请日：2013-11-11

Applicant: QUALCOMM Incorporated

Inventor： Maulin Pareshbhai Bhagat ,  Thomas Andrew Myers ,  Lan Nan ,  Zhang Jin

IPC: H04B5/00 ,  H03H7/01 ,  H01F38/14 ,  H01L23/522 ,  H01L23/64 ,  H01L49/02 ,  H01L23/66 ,  H01L27/10

CPC classification number: H04B5/0075 ,  H01F38/14 ,  H01L23/5223 ,  H01L23/5227 ,  H01L23/645 ,  H01L23/66 ,  H01L27/101 ,  H01L28/10 ,  H01L2223/6661 ,  H01L2223/6688 ,  H01L2924/0002 ,  H03H7/0115 ,  H01L2924/00

Abstract: A tunable guard ring for improved circuit isolation is disclosed. In an exemplary embodiment, an apparatus includes a closed loop guard ring formed on an integrated circuit and magnetically coupled by a selected coupling factor to a first inductor formed on the integrated circuit. The apparatus also includes a tunable capacitor forming a portion of the closed loop guard ring and configured to reduce magnetic field coupling from the first inductor to a second inductor.

Abstract translation: 公开了一种用于改善电路隔离的可调保护环。 在一个示例性实施例中，一种装置包括形成在集成电路上的闭环保护环，并通过选定的耦合因素磁耦合到​​形成在集成电路上的第一电感器。 该装置还包括形成闭环保护环的一部分的可调电容器，并且被配置为减小从第一电感器到第二电感器的磁场耦合。

公开(公告)号：US09537197B2

公开(公告)日：2017-01-03

申请号：US14559503

申请日：2014-12-03

Applicant: QUALCOMM Incorporated

Inventor： Darryl Jessie ,  Lan Nan

IPC: H01P3/00 ,  H01L23/00 ,  H01L23/66 ,  H01L21/768 ,  H01L23/528

CPC classification number: H01P3/006 ,  H01L21/768 ,  H01L23/5225 ,  H01L23/525 ,  H01L23/528 ,  H01L23/66 ,  H01L24/11 ,  H01L24/14 ,  H01L2223/6605 ,  H01L2223/6627 ,  H01P3/003 ,  H05K1/0219 ,  H05K2201/0305 ,  H05K2201/09236 ,  H05K2201/09336 ,  H05K2201/09618

Abstract: In an integrated circuit package that houses radio-frequency (RF) circuits or components using wafer-level packaging (WLP), an RF-signal transmission structure includes a signal-carrying conductive line positioned between grounded conductive lines to avoid undesirable coupling between the signal-carrying conductive line and other RF circuits or components in the same package.

Abstract translation: 在使用晶片级封装（WLP）容纳射频（RF）电路或部件的集成电路封装中，RF信号传输结构包括位于接地导线之间的信号承载导线，以避免信号之间的不期望的耦合 - 同一封装中的导线和其他RF电路或组件。