公开(公告)号：US20250110174A1

公开(公告)日：2025-04-03

申请号：US18479598

申请日：2023-10-02

Applicant: QUALCOMM Incorporated

Inventor： Palkesh JAIN ,  Rahul GULATI ,  Niraj Shantilal PALIWAL ,  Nikhil Rajendra PATIL ,  Vipul Deepak AHUJA

IPC: G01R31/28 ,  H01L23/367

Abstract: Methods and apparatuses directed to detecting the degradation of electronic components based on thermal testing. In some examples, a device includes heat detection elements, a temperature controller, a memory, and a processor. The temperature controller can receive a signal from each of the heat detection elements and determine a corresponding operating temperature. The processor can receive the operating temperatures from the temperature controller, and can read from the memory a threshold temperature corresponding to each of the heat detection elements. Further, the processor can compare the operating temperatures to their corresponding threshold temperatures and, based on the comparison, generate thermal error data characterizing detected thermal discrepancies. The processor can transmit the thermal error data to cause further operations, such as the disabling of a safety feature, or the display of a warning message, for example.