公开(公告)号：US20180173288A1

公开(公告)日：2018-06-21

申请号：US15385529

申请日：2016-12-20

Applicant: QUALCOMM Incorporated

Inventor： Xiongfei Meng ,  Pranjal Srivastava ,  Patrick Drennan

IPC: G06F1/32 ,  H03K3/03

CPC classification number: G06F1/3296 ,  G06F1/04 ,  G06F1/3206 ,  H03K3/0315

Abstract: According to certain aspects, a system includes frequency measurement devices distributed across a power domain on a chip, wherein the power domain is divided into multiple power sub-domains, and each of the power sub-domains includes a respective subset of the frequency measurement devices. The system also includes a power manager. For each of the power sub-domains, the power manager is configured to receive frequency measurements from the respective subset of the frequency measurement devices, and determine a supply voltage setting for the power sub-domain based on the received frequency measurements from the respective subset of the frequency measurement devices.

公开(公告)号：US09337146B1

公开(公告)日：2016-05-10

申请号：US14611035

申请日：2015-01-30

Applicant: QUALCOMM Incorporated

Inventor： Wei Yi ,  Yi Lou ,  Paul Penzes ,  Pranjal Srivastava

IPC: H01L23/48 ,  H01L23/528 ,  H01L27/06 ,  H01L23/00

CPC classification number: H01L24/82 ,  G06F17/5077 ,  H01L23/481 ,  H01L23/528 ,  H01L25/0657 ,  H01L27/0688

Abstract: A particular three-dimensional integrated circuit stack includes a first die including a first bonding interface and a first plurality of interconnect layers arranged according to a first Manhattan wiring scheme. The three-dimensional integrated circuit stack also includes a second die including a second bonding interface and a second plurality of interconnect layers arranged according to a second Manhattan wiring scheme. The first die and the second die stacked with the first bonding interface coupled to the second bonding interface such that the first Manhattan wiring scheme and the second Manhattan wiring scheme are non-Manhattan with respect to each other.

Abstract translation: 特定的三维集成电路堆叠包括第一管芯，其包括第一接合界面和根据第一曼哈顿布线方案布置的第一多个互连层。 三维集成电路堆叠还包括第二管芯，其包括根据第二曼哈顿布线方案布置的第二接合界面和第二多个互连层。 所述第一管芯和所述第二管芯与所述第一接合界面堆叠而耦合到所述第二接合界面，使得所述第一曼哈顿布线方案和所述第二曼哈顿布线方案相对于彼此不是曼哈顿。