公开(公告)号：US20240022008A1

公开(公告)日：2024-01-18

申请号：US18174470

申请日：2023-02-24

Applicant: QUALCOMM Incorporated

Inventor： Julio ZEGARRA ,  Peter LIEN ,  Sang-June PARK ,  Darryl Sheldon JESSIE ,  Alberto CICALINI ,  Sean OAK ,  Neil BURNS

IPC: H01Q23/00 ,  H01Q1/52 ,  H01Q1/48 ,  H05K1/18

CPC classification number: H01Q23/00 ,  H01Q1/526 ,  H01Q1/48 ,  H05K1/189

Abstract: An integrated millimeter wave antenna module may include at least one antenna array connected to a wiring board with a flexible printed circuit without any additional connectors. The integrated module may include an antenna, a flexible printed circuit attached to the antenna on one end and a wiring board on the other end.

公开(公告)号：US20210119350A1

公开(公告)日：2021-04-22

申请号：US16825615

申请日：2020-03-20

Applicant: QUALCOMM Incorporated

Inventor： Julio ZEGARRA ,  Peter LIEN ,  Sang-June PARK ,  Darryl Sheldon JESSIE ,  Alberto CICALINI ,  Sean OAK ,  Neil BURNS

IPC: H01Q23/00 ,  H05K1/18 ,  H01Q1/48 ,  H01Q1/52

Abstract: An integrated millimeter wave antenna module may include at least one antenna array directly connected to a wiring board with a flexible printed circuit without any additional connectors. The integrated module may include an antenna, a flexible printed circuit attached to the antenna on one end and a wiring board on the other end.