公开(公告)号：US20220120788A1

公开(公告)日：2022-04-21

申请号：US17076581

申请日：2020-10-21

Applicant: QUALCOMM Incorporated

Inventor： Chuan WANG ,  Li LIU ,  Kevin Hsi-Huai WANG ,  Bhushan Shanti ASURI ,  Shrenik PATEL ,  Anushruti BHATTACHARYA ,  Laya MOHAMMADI ,  Sang-June PARK

IPC: G01R15/18 ,  H01Q3/30 ,  H01Q23/00 ,  H04B1/04 ,  G01R19/10

Abstract: Devices and methods for detection of active return loss for an antenna element of a plurality of antenna elements of a phased array antenna are provided. An exemplary device can convert a voltage differential at an input of a power amplifier (PA) to first current. The device can convert a coupled voltage corresponding to a signal transmitted from the PA to a respective antenna element, to a second current. The device can convert a reflected voltage corresponding to a signal reflected from the respective antenna element, to a third current. The device can convert the first current, the second current, and the third current to an output voltage at a generator output. The device can further have a controller that can adaptively generate codebooks for transmission based on the output voltage.

公开(公告)号：US20210119350A1

公开(公告)日：2021-04-22

申请号：US16825615

申请日：2020-03-20

Applicant: QUALCOMM Incorporated

Inventor： Julio ZEGARRA ,  Peter LIEN ,  Sang-June PARK ,  Darryl Sheldon JESSIE ,  Alberto CICALINI ,  Sean OAK ,  Neil BURNS

IPC: H01Q23/00 ,  H05K1/18 ,  H01Q1/48 ,  H01Q1/52

Abstract: An integrated millimeter wave antenna module may include at least one antenna array directly connected to a wiring board with a flexible printed circuit without any additional connectors. The integrated module may include an antenna, a flexible printed circuit attached to the antenna on one end and a wiring board on the other end.

公开(公告)号：US20240022008A1

公开(公告)日：2024-01-18

申请号：US18174470

申请日：2023-02-24

Applicant: QUALCOMM Incorporated

Inventor： Julio ZEGARRA ,  Peter LIEN ,  Sang-June PARK ,  Darryl Sheldon JESSIE ,  Alberto CICALINI ,  Sean OAK ,  Neil BURNS

IPC: H01Q23/00 ,  H01Q1/52 ,  H01Q1/48 ,  H05K1/18

CPC classification number: H01Q23/00 ,  H01Q1/526 ,  H01Q1/48 ,  H05K1/189

Abstract: An integrated millimeter wave antenna module may include at least one antenna array connected to a wiring board with a flexible printed circuit without any additional connectors. The integrated module may include an antenna, a flexible printed circuit attached to the antenna on one end and a wiring board on the other end.

公开(公告)号：US20230403089A1

公开(公告)日：2023-12-14

申请号：US18452236

申请日：2023-08-18

Applicant: QUALCOMM Incorporated

Inventor： Mingming CAI ,  Raghu Narayan CHALLA ,  Revathi SUNDARA RAGHAVAN ,  Michael BURKE ,  Abhilash BANGALORE RAVI ,  Mihir Vijay LAGHATE ,  Shrenik PATEL ,  Sang-June PARK ,  Mohammad Ali TASSOUDJI ,  Sudarsan KRISHNAN ,  Vasanthan RAGHAVAN ,  Siddharth KAMATH

IPC: H04B17/364 ,  H04B7/08

CPC classification number: H04B17/364 ,  H04B7/0814 ,  H04B7/0822 ,  H04B7/0413

Abstract: Various aspects of the present disclosure generally relate to wireless communication and testing. In some aspects, a device may receive information identifying a mount orientation of a wireless communication device, wherein the mount orientation indicates an orientation of a coordinate system of the wireless communication device relative to a coordinate system of a positioner. The device may capture measurement information at each position of a set of positions of the wireless communication device, wherein the set of positions comprises positions of the wireless communication device as the wireless communication device is rotated around an axis by the positioner, and wherein the measurement information is captured based at least in part on the mount orientation. The device may provide information identifying the measurement information. Some techniques and apparatuses described herein may use the measurement information to generate a codebook for beam generation. Numerous other aspects are provided.

公开(公告)号：US20200350658A1

公开(公告)日：2020-11-05

申请号：US16863874

申请日：2020-04-30

Applicant: QUALCOMM Incorporated

Inventor： Sang-June PARK ,  Peter Han LIEN ,  Eric LUNZER ,  Timothy VU

IPC: H01Q1/22 ,  H01Q1/50 ,  H04B1/40 ,  H01Q23/00

Abstract: Aspects described herein relate to at least a portion of a connector configured to support wireless communications that includes multiple chambers, each at least partially enclosed by a continuous isolation structure to provide electrical signal isolation and defining an inner surface. At least one terminal in a first chamber of the multiple chambers is configured for a first interface, and at least one terminal in a second chamber of the multiple chambers is configured for a second interface.

公开(公告)号：US20200169266A1

公开(公告)日：2020-05-28

申请号：US16202723

申请日：2018-11-28

Applicant: QUALCOMM Incorporated

Inventor： Shahin MEHDIZAD TALEIE ,  Behnam SEDIGHI ,  Dongwon SEO ,  Parisa MAHMOUDIDARYAN ,  Bhushan Shanti ASURI ,  Sang-June PARK ,  Shrenik PATEL

IPC: H03M1/66

Abstract: Certain aspects of the present disclosure generally relate to circuitry and techniques for digital-to-analog conversion. One example system for digital-to-analog conversion generally includes a first digital-to-analog converter (DAC) having an input coupled to an input node of the system and a mixing-mode DAC having an input coupled to an input node of the system. The mixing-mode DAC may include a second DAC and a mixer, an output of the second DAC being coupled to an input of the mixer. The system may also include a combiner, wherein an output of the first DAC is coupled to a first input of the combiner, and wherein an output of the mixer is coupled to a second input of the combiner.

公开(公告)号：US20250079716A1

公开(公告)日：2025-03-06

申请号：US18460480

申请日：2023-09-01

Applicant: QUALCOMM Incorporated

Inventor： Jeahyeong HAN ,  Sang-June PARK ,  Sanjaya Kumar KHATUA ,  Darryl Sheldon JESSIE ,  Rajneesh KUMAR

IPC: H01Q13/10 ,  H01Q1/38 ,  H01Q21/06

Abstract: A package comprising a substrate, an integrated device coupled to a first surface of the substrate through at least a first plurality of solder interconnects; and an antenna device coupled to a second surface of the substrate through at least a second plurality of solder interconnects. The antenna device comprises an antenna device dielectric layer; at least one antenna located on a first surface of the antenna device dielectric layer; a shield located on at least one lateral surface of the antenna device; and a slot opening on the first surface of the antenna device.

公开(公告)号：US20240204795A1

公开(公告)日：2024-06-20

申请号：US18068941

申请日：2022-12-20

Applicant: QUALCOMM Incorporated

Inventor： Ashok SWAMINATHAN ,  Nitz SAPUTRA ,  Negar RASHIDI ,  Shahin MEHDIZAD TALEIE ,  Chinmaya MISHRA ,  Dongwon SEO ,  Jong Hyeon PARK ,  Sang-June PARK

IPC: H03M1/66 ,  H03M1/82

CPC classification number: H03M1/665 ,  H03M1/82

Abstract: Methods and apparatus for sharing digital-to-analog (DAC) converters in a reconfigurable DAC circuit to support two or more transmit chains of a wireless transmitter configured for different radio access technologies (RATs) and/or different transmitter architectures. One example DAC circuit generally includes at least four DACs and a plurality of switches coupled to outputs of the at least four DACs such that the DAC circuit is configured as a multi-channel DAC circuit with at least four channels for a first set of one or more frequency bands and as an interleaved DAC circuit with at least two channels for a second set of one or more frequency bands different from the first set of frequency bands.

公开(公告)号：US20230030569A1

公开(公告)日：2023-02-02

申请号：US17392005

申请日：2021-08-02

Applicant: QUALCOMM Incorporated

Inventor： Jonghae KIM ,  Sang-June PARK ,  Periannan CHIDAMBARAM

IPC: H03H7/38 ,  H01P5/12 ,  H04B1/38

Abstract: An aspect relates to a signal power splitter/combiner including a first signal port; a first resistor; a first impedance transformer coupled in series with the first resistor between the first signal port and a first intermediate node; a second impedance transformer coupled between the first intermediate node and a second signal port; a third impedance transformer coupled between the first intermediate node and a third signal port; and a second resistor coupled between the second and third signal ports. The signal power splitter/combiner may further include a fourth impedance transformer coupled between the second impedance transformer and the second signal port, a fifth impedance transformer coupled between the third impedance transformer and the third signal port; and a third resistor coupled between a third intermediate nod.

公开(公告)号：US20230247561A1

公开(公告)日：2023-08-03

申请号：US18189946

申请日：2023-03-24

Applicant: QUALCOMM Incorporated

Inventor： Ruhua HE ,  Shrenik PATEL ,  Sang-June PARK ,  Mihir Vijay LAGHATE ,  Raghu Narayan CHALLA

IPC: H04W52/14 ,  H04W52/42 ,  H04W52/24 ,  H04W72/044 ,  H04L1/00 ,  H04L5/00 ,  H04W52/52 ,  H04B17/318

CPC classification number: H04W52/146 ,  H04B17/318 ,  H04L1/0004 ,  H04L5/0092 ,  H04W52/42 ,  H04W52/52 ,  H04W52/241 ,  H04W72/046 ,  H04W72/0473

Abstract: In an aspect of the disclosure, a method, a computer-readable medium, and an apparatus are provided. The apparatus may be configured to determine a PSD based on a transmission power associated with transmission of an uplink signal. The apparatus may be configured to select one of a first beam or a second beam for the transmission of the uplink signal based on the PSD. The second beam may be wider than the first beam, and may be generated by a single antenna element of the apparatus. The apparatus may be configured to transmit the uplink signal using the selected one of the first beam or the second beam.