公开(公告)号：US20210104467A1

公开(公告)日：2021-04-08

申请号：US16590718

申请日：2019-10-02

Applicant: QUALCOMM Incorporated

Inventor： Aniket PATIL ,  Brigham NAVAJA ,  Hong Bok WE ,  Yuzhe ZHANG

IPC: H01L23/538 ,  H01L23/495 ,  H01L23/31

Abstract: A package that includes a second redistribution portion, a die coupled to the second redistribution portion, an encapsulation layer encapsulating the die, and a first redistribution portion coupled to the second redistribution portion. The first redistribution portion is located laterally to the die. The first redistribution portion is located over the second redistribution portion. The first redistribution portion and the second redistribution portion are configured to provide one or more electrical paths for the die.