公开(公告)号：US11937405B2

公开(公告)日：2024-03-19

申请号：US17387415

申请日：2021-07-28

Applicant: QUANTA COMPUTER INC.

Inventor： Chao-Jung Chen ,  Yu Nien Huang ,  Sin-Hong Lien ,  Jen-Mao Chen

IPC: H05K7/20

CPC classification number: H05K7/20663 ,  H05K7/20327 ,  H05K7/20354 ,  H05K7/202

Abstract: A system includes a rack of servers and a fluid circuit for cooling the rack of servers. The fluid circuit includes one or more cooling modules, a heat-exchanging module, and a pump. The one or more cooling modules are thermally connected to a conduit for flowing a coolant therethrough. Each cooling module includes a heat-exchanger thermally connected to the conduit and a chiller fluidly coupled to the heat-exchanger. The heat-exchanging module is fluidly connected to an outlet of the conduit. The pump is configured to drive the coolant from the heat-exchanging module to each server in the rack of servers.

公开(公告)号：US11737246B2

公开(公告)日：2023-08-22

申请号：US17393725

申请日：2021-08-04

Applicant: QUANTA COMPUTER INC.

Inventor： Chao-Jung Chen ,  Yu Nien Huang ,  Sin-Hong Lien

IPC: H05K7/20 ,  F28D15/02 ,  F28D15/00 ,  F28F9/00

CPC classification number: H05K7/20781 ,  H05K7/20272 ,  H05K7/20736 ,  F28D15/00 ,  F28D2015/0216 ,  F28F9/00

Abstract: A cooling device for a computing system is disclosed. The cooling device includes an inlet conduit, a first radiator, a second radiator, a connecting conduit, and an outlet conduit. The first radiator has a first top tank and a first bottom tank. The first top tank is coupled to the inlet conduit. The second radiator has a second top tank and a second bottom tank. The second radiator is positioned parallel to the first radiator. The first radiator and the second radiator are positioned at an angle relative to a bottom panel of the computing system. The connecting conduit has a first end coupled to the first bottom tank and a second end coupled to the second bottom tank. The outlet conduit is coupled to the second top tank.