公开(公告)号：US20240055319A1

公开(公告)日：2024-02-15

申请号：US18218670

申请日：2023-07-06

Applicant: Qorvo US, Inc.

Inventor： Matthew Irvine ,  Dylan Murdock

IPC: H01L23/373 ,  H01L23/00 ,  H01L23/367

CPC classification number: H01L23/3731 ,  H01L24/32 ,  H01L23/3675 ,  H01L24/73 ,  H01L2224/48155 ,  H01L2224/28 ,  H01L2924/141

Abstract: A circuit package with improved thermal management is disclosed. In one aspect, a ceramic insert is provided within a package having heat-producing circuitry thereon. The ceramic insert replaces traditional laminate inserts and provides a better thermal path to remove heat from leads and/or traces within the package. More particularly, the ceramic insert more readily transfers and/or dissipates heat that might otherwise accumulate at an output port where a solder junction may be made to couple the output port to external elements.