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公开(公告)号：US11665867B2
公开(公告)日：2023-05-30
申请号：US17663878
申请日：2022-05-18
Applicant: Qorvo US, Inc.
Inventor： Dylan Murdock
CPC classification number: H05K7/209 , B33Y80/00 , H05K7/1434 , H05K7/20936
Abstract: Thermal structures and, more particularly, improved thermal structures for heat transfer devices and spatial power-combining devices are disclosed. A spatial power-combining device may include a plurality of amplifier assemblies and each amplifier assembly includes a body structure that supports an input antenna structure, an amplifier, and an output antenna structure. One or more heat sinks may be partially or completely embedded within a body structure of such amplifier assemblies to provide effective heat dissipation paths away from amplifiers. Heat sinks may include single-phase or two-phase materials and may include pre-fabricated complex thermal structures. Embedded heat sinks may be provided by progressively forming unitary body structures around heat sinks by additive manufacturing techniques.
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公开(公告)号：US11564337B2
公开(公告)日：2023-01-24
申请号：US16821531
申请日：2020-03-17
Applicant: Qorvo US, Inc.
Inventor： Dylan Murdock
Abstract: Thermal structures and, more particularly, improved thermal structures for heat transfer devices and spatial power-combining devices are disclosed. A spatial power-combining device may include a plurality of amplifier assemblies and each amplifier assembly includes a body structure that supports an input antenna structure, an amplifier, and an output antenna structure. One or more heat sinks may be partially or completely embedded within a body structure of such amplifier assemblies to provide effective heat dissipation paths away from amplifiers. Heat sinks may include single-phase or two-phase materials and may include pre-fabricated complex thermal structures. Embedded heat sinks may be provided by progressively forming unitary body structures around heat sinks by additive manufacturing techniques.
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公开(公告)号：US12266582B2
公开(公告)日：2025-04-01
申请号：US17394083
申请日：2021-08-04
Applicant: Qorvo US, Inc.
Inventor： Dylan Murdock
Abstract: The present disclosure relates to a hermetic package capable of handling a high coefficient of thermal expansion (CTE) mismatch configuration. The disclosed hermetic package includes a metal base and multiple segments that are discrete from each other. Herein, a gap exists between every two adjacent ceramic wall segments and is sealed with a connecting material. The ceramic wall segments with the connecting material form a ring wall, where the gap between every two adjacent ceramic wall segments is located at a corner of the ring wall. The metal base is either surrounded by the ring wall or underneath the ring wall.
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公开(公告)号：US11791251B2
公开(公告)日：2023-10-17
申请号：US17388499
申请日：2021-07-29
Applicant: Qorvo US, Inc.
Inventor： Dylan Murdock
IPC: H01L23/34 , H01L23/498 , H01L25/16 , H01L23/057 , H01L23/00 , H01L23/047 , H01L23/373
CPC classification number: H01L23/49822 , H01L23/49811 , H01L23/49838 , H01L25/162 , H01L25/165 , H01L23/047 , H01L23/057 , H01L23/3735 , H01L24/48 , H01L24/73 , H01L2224/48155 , H01L2224/73265
Abstract: The present disclosure relates to a package capable of handling high radio frequency (RF) power, which includes a carrier, a ring structure attached to a top surface of the carrier, an RF die attached to the top surface of the carrier within an opening of the ring structure and electrically connected to the ring structure, a heat spreader attached to a top surface of the ring structure, and an output signal lead configured to send out RF output signals generated by the RF die. Herein, the heat spreader covers a portion of the top surface of the ring structure at an output side of the package, and the output signal lead is attached to a top surface of the heat spreader. As such, the RF output signals are capable of being transmitted from the RF die to the output signal lead through the ring structure and the heat spreader.
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公开(公告)号：US11621469B2
公开(公告)日：2023-04-04
申请号：US17245114
申请日：2021-04-30
Applicant: Qorvo US, Inc.
Inventor： John Kitt , Dylan Murdock
Abstract: Power-combining devices, and more particularly spatial power-combining devices with increased output power are disclosed. Increased output power may be realized by increasing a number of transmission paths for amplification that are associated with each amplifier assembly of a spatial power-combining device. Each transmission path may include an input antenna structure, an amplifier, and an output antenna structure for providing amplification of signals that pass therethrough. In this manner, a total number of transmission paths for amplification may be increased without having to increase a total number of amplifier assemblies. Further improvements to electrical separation and stability between neighboring amplifier assemblies may be provided by electrically grounded conductive sheets that are arranged between neighboring amplifier assemblies.
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Patent Agency Ranking
公开(公告)号：US20200162046A1
公开(公告)日：2020-05-21
申请号：US16191541
申请日：2018-11-15
Applicant: Qorvo US, Inc.
Inventor： Christo Bojkov , Dylan Murdock , Robert Charles Dry
Abstract: Improved structures for spatial power-combining devices are disclosed. A spatial power-combining device includes a plurality of amplifier assemblies and each amplifier assembly includes a body structure that supports an input antenna structure, an amplifier, and an output antenna structure. According to embodiments disclosed herein, the body structure comprises a material that is configured to provide the spatial power-combining device with reduced weight while maintaining good thermal dissipation for heat generated by the amplifiers. In certain embodiments, the body structure may comprise an allotrope of carbon such as graphite or graphene, among others. In certain embodiments, the body structure may include one or more thermal vias configured to dissipate heat from the amplifier.
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公开(公告)号：US20180202722A1
公开(公告)日：2018-07-19
申请号：US15874534
申请日：2018-01-18
Applicant: Qorvo US, Inc.
Inventor： Eric Jackson , Dylan Murdock
IPC: F28D7/02
Abstract: A liquid heat transfer device with improved heat transfer into a heating or cooling fluid is disclosed. The heat transfer device incorporates an element which creates a helical flow path through a fluid conduit to more efficiently dissipate heat within a space-constrained environment without increasing the diameter or overall length of the fluid conduit.
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公开(公告)号：US12119281B2
公开(公告)日：2024-10-15
申请号：US17394093
申请日：2021-08-04
Applicant: Qorvo US, Inc.
Inventor： Dylan Murdock
CPC classification number: H01L23/3142 , H01L23/04 , H01L23/10 , H01L23/291 , H01L23/315 , H01L23/3736 , H01L24/48 , H01L24/49 , H01L2224/48225 , H01L2224/49176 , H01L2924/01042 , H01L2924/01074 , H01L2924/0132 , H01L2924/01403 , H01L2924/05432 , H01L2924/15153 , H01L2924/1517 , H01L2924/15747 , H01L2924/15763 , H01L2924/15787 , H01L2924/16747 , H01L2924/1676 , H01L2924/173 , H01L2924/17747 , H01L2924/1776 , H01L2924/3512
Abstract: The present disclosure relates to a hermetic package capable of handling a high coefficient of thermal expansion (CTE) mismatch configuration. The disclosed hermetic package includes a metal base and multiple segments that are discrete from each other. Herein, a gap exists between every two adjacent ceramic wall segments and is sealed with a connecting material. The ceramic wall segments with the connecting material form a ring wall, where the gap between every two adjacent ceramic wall segments is located at a corner of the ring wall. The metal base is either surrounded by the ring wall or underneath the ring wall.
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公开(公告)号：US20220247061A1
公开(公告)日：2022-08-04
申请号：US17245114
申请日：2021-04-30
Applicant: Qorvo US, Inc.
Inventor： John Kitt , Dylan Murdock
Abstract: Power-combining devices, and more particularly spatial power-combining devices with increased output power are disclosed. Increased output power may be realized by increasing a number of transmission paths for amplification that are associated with each amplifier assembly of a spatial power-combining device. Each transmission path may include an input antenna structure, an amplifier, and an output antenna structure for providing amplification of signals that pass therethrough. In this manner, a total number of transmission paths for amplification may be increased without having to increase a total number of amplifier assemblies. Further improvements to electrical separation and stability between neighboring amplifier assemblies may be provided by electrically grounded conductive sheets that are arranged between neighboring amplifier assemblies.
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公开(公告)号：US20210298207A1
公开(公告)日：2021-09-23
申请号：US16821531
申请日：2020-03-17
Applicant: Qorvo US, Inc.
Inventor： Dylan Murdock
Abstract: Thermal structures and, more particularly, improved thermal structures for heat transfer devices and spatial power-combining devices are disclosed. A spatial power-combining device may include a plurality of amplifier assemblies and each amplifier assembly includes a body structure that supports an input antenna structure, an amplifier, and an output antenna structure. One or more heat sinks may be partially or completely embedded within a body structure of such amplifier assemblies to provide effective heat dissipation paths away from amplifiers. Heat sinks may include single-phase or two-phase materials and may include pre-fabricated complex thermal structures. Embedded heat sinks may be provided by progressively forming unitary body structures around heat sinks by additive manufacturing techniques.
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