公开(公告)号：US12101610B2

公开(公告)日：2024-09-24

申请号：US17741215

申请日：2022-05-10

Applicant: Qualcomm Technologies Inc.

Inventor： Michael Carfore ,  Tomer Saraf

IPC: H04R3/00 ,  H10N30/30

CPC classification number: H04R3/002 ,  H04R3/007 ,  H10N30/302 ,  H04R2201/003

Abstract: Illustrative embodiments enable a MEMS transducer to quickly recover from, acoustic overload events by quickly resetting signal processing circuitry downstream from a MEMS transducer. An acoustic overload sensor detects occurrence of an acoustic overload event, and triggers a reset circuit to operate a set of switches to rapidly drain charge from a corresponding set of capacitances within the transducer, or within the signal processing circuitry, thereby resetting the signal processing circuitry more rapidly than would occur if said transducer or circuitry were allowed to recover on its own.