公开(公告)号：US20240196573A1

公开(公告)日：2024-06-13

申请号：US18335720

申请日：2023-06-15

Applicant: Quanta Computer Inc.

Inventor： Yi-Chieh CHEN ,  Yueh-Chang WU ,  Yan-Kuei CHEN ,  Yi-Ta HSU

IPC: H05K7/20

CPC classification number: H05K7/20836 ,  H05K7/20163 ,  H05K7/20718

Abstract: An example method for providing cooling capacity and reducing power consumption of a server assembly is disclosed. The method includes receiving temperature information corresponding to a CPU of an electrical component in the server assembly, which further includes an equipment room, and a cabinet fan module positioned adjacent to a side of the equipment room. The cabinet fan module includes electric fans therein, and the electrical component is implemented in the equipment room. The method includes determining a current power level of the CPU, and determining, using the temperature information and the current power level, a first operating speed for the electric fans. Furthermore, the method includes combining the first operating speed with a second operating speed received from a proportional-integral-derivative controller to determine a combined operating speed. The method still further includes instructing the electric fans to operate at the combined operating speed.

公开(公告)号：US20190297748A1

公开(公告)日：2019-09-26

申请号：US15926068

申请日：2018-03-20

Applicant: QUANTA COMPUTER INC.

Inventor： Chao-Jung CHEN ,  Yi-Chieh CHEN ,  Yueh-Chang WU ,  Yi-Ta HSU

IPC: H05K7/20

Abstract: A method and structure for improving efficiency of cooling and temperature uniformity among a plurality of heat generating electronic devices arranged in rows within a housing, such as a GPU server, utilizing a single source of cooling air. The electronic devices are arranged in a plurality of rows, but the heat sinks for the last row are elevated above the heat sinks of the first row so as to occupy different positions within the cooling air stream. In some embodiments the heat sinks of the electronic devices are extended forward so as to reside near the heat sinks of the electronic devices in the first row, but in a different flow path of cooling air. In other embodiments, a thermo siphon refrigeration system is provided for the electronic devices in the last row, and may be provided for the electronic devices in the first row as well.