公开(公告)号：US20210365087A1

公开(公告)日：2021-11-25

申请号：US16878026

申请日：2020-05-19

Applicant: QUANTA COMPUTER INC.

Inventor： Yi-Chieh CHEN ,  Yueh-Chang WU ,  Yan-Kuei CHEN ,  Hsin-Yu LIN

IPC: G06F1/20

Abstract: Cooling devices, such as fans, installed in a computing device can be automatically identified by reading an encoded signal from the cooling device's tachometer signal line. A cooling device can temporarily output an encoded signal in response to a trigger event, such as a power on event (e.g., powering-on of the cooling device). A controller, such as a baseboard management controller (BMC), can receive the encoded signal and decode the signal to determine identification information about the cooling device, such as vendor information and/or model information. The identification information about the cooling device can be stored, logged, output, and/or used to customize the operation of the cooling device.

公开(公告)号：US20240196573A1

公开(公告)日：2024-06-13

申请号：US18335720

申请日：2023-06-15

Applicant: Quanta Computer Inc.

Inventor： Yi-Chieh CHEN ,  Yueh-Chang WU ,  Yan-Kuei CHEN ,  Yi-Ta HSU

IPC: H05K7/20

CPC classification number: H05K7/20836 ,  H05K7/20163 ,  H05K7/20718

Abstract: An example method for providing cooling capacity and reducing power consumption of a server assembly is disclosed. The method includes receiving temperature information corresponding to a CPU of an electrical component in the server assembly, which further includes an equipment room, and a cabinet fan module positioned adjacent to a side of the equipment room. The cabinet fan module includes electric fans therein, and the electrical component is implemented in the equipment room. The method includes determining a current power level of the CPU, and determining, using the temperature information and the current power level, a first operating speed for the electric fans. Furthermore, the method includes combining the first operating speed with a second operating speed received from a proportional-integral-derivative controller to determine a combined operating speed. The method still further includes instructing the electric fans to operate at the combined operating speed.

公开(公告)号：US20230247800A1

公开(公告)日：2023-08-03

申请号：US17587484

申请日：2022-01-28

Applicant: Quanta Computer Inc.

Inventor： Yi-Chieh CHEN ,  Yueh-Chang WU ,  Yan-Kuei CHEN ,  Yangtzu LEE

IPC: H05K7/20

CPC classification number: H05K7/207 ,  H05K7/20181

Abstract: A computing system includes a cabinet, an inlet temperature sensor, a cooling device, an environmental sensor, and at least one processor. The cabinet houses at least one computing device. The inlet temperature sensor is configured to detect inlet temperature data for the at least one computing device. The inlet temperature data represents internal temperature within the cabinet. The cooling device is coupled to the cabinet for maintaining temperature within the cabinet. The environmental sensor is configured to detect environmental temperature data external to the cabinet. The environmental temperature data represents external temperature outside the cabinet. The at least one processor is configured to: (a) determine if one or more of the inlet temperature data and the environmental temperature data exceeds a temperature range; and (b) in response to the temperature range being exceeded, generate a first warning signal indicating a temperature problem.

公开(公告)号：US20240049425A1

公开(公告)日：2024-02-08

申请号：US17816889

申请日：2022-08-02

Applicant: Quanta Computer Inc.

Inventor： Yi-Chieh CHEN ,  Yueh-Chang WU ,  Yan-Kuei CHEN ,  Yu-Hung WANG

IPC: H05K7/20 ,  G01M3/40 ,  G06F1/20

CPC classification number: H05K7/20272 ,  H05K7/20254 ,  G01M3/40 ,  G06F1/206

Abstract: A structure for protecting an electronic component from coolant leaking from a liquid cooling system is disclosed. The liquid cooling system has a manifold collecting and supplying coolant to a cold plate via inlet and outlet tubes. The cold plate is mounted over a heat-generating component on a circuit board. The structure includes a drip tray having a top surface and a length approximately the distance between the manifold and the cold plate. The drip tray includes a trough for collection of leaking coolant. The tray is inserted between the circuit board and the inlet and outlet tubes.

公开(公告)号：US20220174845A1

公开(公告)日：2022-06-02

申请号：US17247149

申请日：2020-12-01

Applicant: Quanta Computer Inc.

Inventor： Yi-Chieh CHEN ,  Yueh-Chang WU ,  Yan-Kuei CHEN ,  Te-Chuan WANG

IPC: H05K7/20

Abstract: A cooling system for an electronic device includes a central processing unit (CPU), a remote heat sink, and a heat-pipe module. The CPU is mounted on a base of the electronic device, and the remote heat sink receives heat generated by the CPU. The heat-pipe module has a plurality of heat pipes for transferring the heat generated by the CPU to the remote heat sink. Each heat pipe has a circular section extending between a first end and a second end. The first end has a flattened, non-circular shape, and is coupled to the base near the CPU. The second end is coupled to the remote heat sink. The first end of each heat pipe is in direct contact with at least another first end of an adjacent heat pipe.