公开(公告)号：US20240272349A1

公开(公告)日：2024-08-15

申请号：US18538413

申请日：2023-12-13

Applicant: RADIANT OPTO-ELECTRONICS CORPORATION

Inventor： Kuan-Feng CHEN ,  Che-Kai CHANG ,  Jyun-Siang CHEN ,  Chih-Chun WANG

IPC: F21V8/00

CPC classification number: G02B6/0085 ,  G02B6/0068 ,  G02B6/0088

Abstract: A backlight module comprises a back plate, a light-guiding plate arranged at the back plate and a light source module. The light-guiding plate has an incident surface and an emitting surface connected to each other. The light source module has a base board and at least one light-emitting unit. The base board is disposed at the emitting surface of the light-guiding plate. The light-emitting unit is mounted at the base board and faces the incident surface of the light-guiding plate. The base board comprises an electrically-connecting portion and at least one heat dissipation portion. The electrically-connecting portion is electrically connected to the light-emitting unit. The heat dissipation portion extends from the electrically-connecting portion toward a direction away from the light-guiding plate without being electrically connected to the light-emitting unit. A display device having the backlight module is also provided.

公开(公告)号：US20230360611A1

公开(公告)日：2023-11-09

申请号：US18352234

申请日：2023-07-13

Applicant: Radiant Opto-Electronics Corporation

Inventor： Jui-Lin CHEN ,  Pin-Hsun LEE ,  Yuan-Jhang CHEN ,  Che-Kai CHANG ,  Chun-Hung HO ,  Hung-Yi CHEN

IPC: G09G3/34 ,  F21V8/00

CPC classification number: G09G3/3406 ,  G02B6/0073 ,  G02B6/0081 ,  G02B6/0036 ,  G02B6/0023 ,  G09G2320/06

Abstract: The present disclosure provides a backlight module and a display device. The backlight module includes a light source structure and an optical film. The light source structure includes a substrate, plural light-emitting units and a package structure. The light-emitting units are disposed on the substrate. The package structure covers the light-emitting units, and the package structure has plural convex portions. The optical film is disposed on the light source structure, and the optical film is in contact with the convex portions of the package structure.