Method of electroless plating
    1.
    发明授权
    Method of electroless plating 失效
    化学镀方法

    公开(公告)号:US3877981A

    公开(公告)日:1975-04-15

    申请号:US35572073

    申请日:1973-04-30

    Applicant: RCA CORP

    CPC classification number: C23C18/30 H01L21/288

    Abstract: A thin, discontinuous film of a catalyst is deposited on a surface to be plated. The surface is rinsed with a solution which includes a wetting agent for the surface, and is then electrolessly plated with a metal.

    Abstract translation: 将催化剂薄的不连续薄膜沉积在待镀表面上。 表面用包括用于表面的润湿剂的溶液冲洗,然后用金属无电镀。

    Method of bonding metals together
    2.
    发明授权
    Method of bonding metals together 失效
    将金属接合的方法

    公开(公告)号:US3875652A

    公开(公告)日:1975-04-08

    申请号:US38664273

    申请日:1973-08-08

    Applicant: RCA CORP

    CPC classification number: B23K35/007 B23K20/10 H05K3/328

    Abstract: A wire of a soft metal, such as gold, silver, or copper, can be ultrasonically bonded to a base metal substrate by coating the wire with a thin layer of an alloy of nickel-phosphorus, coating the substrate with a relatively thicker layer of an alloy of cobalt-phosphorus, and applying ultrasonic vibratory energy between the coated wire and the coated substrate. A portion of the thin layer of the nickel-phosphorus is worn away during the application of the ultrasonic vibratory energy, and the wire is bonded directly to the relatively thicker layer of cobaltphosphorus.

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