公开(公告)号：US3619731A

公开(公告)日：1971-11-09

申请号：US3619731D

申请日：1968-10-11

Applicant: RCA CORP

Inventor： BAKER LAWRENCE K ,  SHARDLOW LAWRENCE R

IPC: H01L21/52 ,  H01L25/03 ,  H01L25/07 ,  H01L1/08 ,  H01L1/10 ,  H01L1/14 ,  H01L1/22

CPC classification number: H01L25/074 ,  H01L25/03 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A semiconductor device comprises a substrate, a first semiconductor pellet mounted on the substrate, an insulating material washer mounted on the first pellet, and a second semiconductor pellet mounted on the washer. The second pellet is rigidly secured to the washer and the first pellet, and electrically connected to the first pellet, by means of a solder filling the washer central opening and bonded to both pellets.

公开(公告)号：US3535774A

公开(公告)日：1970-10-27

申请号：US3535774D

申请日：1968-07-09

Applicant: RCA CORP

Inventor： BAKER LAWRENCE K

IPC: H01L23/29 ,  H01L23/31 ,  H01L29/00 ,  B01J17/00 ,  H01L5/00

CPC classification number: H01L23/3157 ,  H01L23/291 ,  H01L29/00 ,  H01L2924/0002 ,  H01L2924/00