Method of fabrication of semiconductor devices
    1.
    发明授权
    Method of fabrication of semiconductor devices 失效
    半导体器件的制造方法

    公开(公告)号:US3686080A

    公开(公告)日:1972-08-22

    申请号:US3686080D

    申请日:1971-07-21

    Applicant: RCA CORP

    CPC classification number: H01L23/53242 H01L29/456 H01L2924/0002 H01L2924/00

    Abstract: IN THE FABRICATION OF CERTAIN TYPES OF SEMICONDUCTOR DEVICES, A SEMICONDUCTOR SUBSTRATE IS PROVIDED WITH SUCCESSIVE LAYERS OF A FIRST LAYER OF TITANIUM, A SECOND LAYER OF A MEMBER OF THE PLATINUM GROUP OF METALS, AND A THIRD LAYER OF TITANIUM, THE LAYERS PREFERABLY BEING PROVIDED IN A PROTETIVE ATMOSPHERE. PORTIONS OF THE UPPERMOST LAYER OF TITANIUM ARE SELECTIVELY ETCHED TO EXPOSED PORTIONS OF THE SECOND LAYER. THE EXPOSED PORTIONS OF THE SECOND LAYER ARE THEN IMMEDIATELY ETCHED AWAY, THE REMAINING PORTIONS OF THE UPPERMOST TITANIUM LAYER SERVING AS AN ETCH MASK IN THE PROCESS. THE PORTIONS OF THE BOTTOM LAYER OF TITANIUM EXPOSED BY THE ETCHING OF THE SECOND LAYER ARE COATED WITH AN ELECTRICALLY NON-CONDUCTIVE COATING, OTHER PORTIONS OF THE SECOND LAYER ARE EXPOSED BY REMOVAL OF THE OVERCOATING OF TITANIUM THEREFROM, AND GOLD IS IMMEDIATELY THEREAFTER PLATED ONTO THE NEWLY EXPOSED SECOND LAYER PORTIONS.

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