公开(公告)号：US3731160A

公开(公告)日：1973-05-01

申请号：US3731160D

申请日：1972-05-08

Applicant: RCA CORP

Inventor： KLEIN N

IPC: H01L23/66 ,  H01L3/00 ,  H01L5/00

CPC classification number: H01L23/66 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/6622 ,  H01L2223/6644 ,  H01L2224/32188 ,  H01L2224/48091 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/1305 ,  H01L2924/14 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2224/45099

Abstract: A semiconductor device assembly includes a semiconductor element mounted on a pedestal of a mounting plate. The mounting plate is secured between a pair of flanges, and co-axial terminals extend from the flanges. The co-axial terminals include outer ground plane walls and inner conductor pins electrically insulated from the outer walls. The conductor pins extend to the semiconductor element. The contacts of the semiconductor element are electrically connected to the mounting plate and conductor pins by short wires. A cover block is mounted on the flanges and extends over the semiconductor element. A retainer ring fits around the cover block and the flanges and firmly secures the cover block to the flanges.

Abstract translation: 半导体器件组件包括安装在安装板的基座上的半导体元件。 安装板固定在一对凸缘之间，同轴端子从凸缘延伸。 同轴端子包括外部接地平面壁和与外壁电绝缘的内部导体引脚。 导体引脚延伸到半导体元件。 半导体元件的触点通过短线电连接到安装板和导体引脚。 盖板安装在凸缘上并在半导体元件上方延伸。 保持环安装在盖板和凸缘周围，并将盖板牢固地固定在法兰上。