Predetermined thickness profiles through electroplating
    1.
    发明授权
    Predetermined thickness profiles through electroplating 失效
    通过电镀预定厚度分布

    公开(公告)号:US3880725A

    公开(公告)日:1975-04-29

    申请号:US45959074

    申请日:1974-04-10

    Applicant: RCA CORP

    CPC classification number: C25D21/12 Y10S204/07

    Abstract: A metal film having a predetermined thickness profile is obtained on a surface of an article through electroplating. The electroplating of the metal film on the article is done with an apparatus including a plurality of modifying electrodes and a body of plating material suspended in a plating solution. Electrical potentials are established at the article to be plated, the body of plating material, and at each one of the modifying electrodes. The particular electrical potential at the article, the body of plating material and at each one of the modifying electrodes is chosen to provide differences in electrical potential which result in a metal film having the predetermined thickness profile.

    Abstract translation: 通过电镀在物品的表面上获得具有预定厚度分布的金属膜。 金属膜在制品上的电镀是用包括多个修饰电极和悬浮在电镀液中的电镀体的装置进行的。 在要镀覆的物品,电镀材料的主体和每个修改电极上建立电位。 选择物品处的特定电位,电镀材料的主体和每个修改电极,以提供导致具有预定厚度分布的金属膜的电位差。

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